The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

This invention relates to an elastomeric article with improved lubricity and donnablity and reduced stickiness/tackiness. According to the methods of the invention, the internal surface of the elastomeric article is coated with a polyisoprene coating. The coating of the invention is formed from synthetic polyisoprene rubber that may or may not contain minor amounts of other components. The coating is preferably directly bonded to the underlying elastomeric article.

A method of forming a finished film comprising extruding a molten polyethylene comprising a diene terpolymer modifier through a die opening to form a film, wherein the diene-terpolymer modifier is a terpolymer comprising ethylene-derived units, C.sub.3 to C.sub.10 -olefin derived units, and diene-derived units; causing the film to progress in a direction away from the die opening; cooling the film at a distance from the die opening, the distance adjusted to allow relaxation of the molten polyethylene prior to solidification and/or crystallization upon cooling; and isolating a finished film therefrom. Desirably, the polyethylene is a linear low density polyethylene, and the die and cooling is suitable for forming a blown film.

A low dielectric high Tg resin composition includes a resin system, a halogen-free flame retardant, a coupling agent, and an inorganic filler. The resin system includes a low dielectric resin, a crosslinking agent, and a polyindene resin which are each added in a specific weight percentage. The low dielectric resin is formed from a monomer composition including styrene, divinylbenzene, and ethylene. Therefore, the low dielectric high Tg resin composition has a glass transition temperature not less than 200 C., and the low dielectric high Tg resin composition after being cured has a dielectric constant (Dk) between 3.0 and 3.2 and a dielectric loss factor (Df) less than 0.0013 at 10 GHz. Based on the above, a prepreg and a metal clad laminate applying the low dielectric high Tg resin composition are further provided.

The present invention relates to the treatment or prevention of skeletal disorders, in particular skeletal diseases, developed by patients that display abnormal increased activation of the fibroblast growth factor receptor 3 (FGFR3), in particular by expression of a constitutively activated mutant of FGFR3.