A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group.

##STR00001##

In Formula (1), n represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group.

There is an expandable vinyl aromatic polymer composition with improved mechanical and insulating properties that includes: a) 60% to 96% by weight of a vinyl aromatic polymer (a); b) 3% to 10% by weight of an expansion agent (b); and c) 1% to 30% by weight of a vinyl aromatic copolymer (c) containing from 1% to 10% by weight of a rubbery component as a dispersed phase,
with the condition that the sum of (a), (b) and (c) is 100% by weight together with the process for its preparation and corresponding use and manufactured goods obtainable from that composition.

Recycled rubber is provided, which is formed by depolymerizing 100 parts by weight of rubber and 0.5 to 10 parts by weight of modifier, wherein the modifier is formed by reacting (a) R.sup.1-M, (b) double bond monomer, (c) ethylene sulfide, and (d) polymerization terminator, wherein R.sup.1 is C.sub.4-C.sub.16 alkyl group, M is Li, Na, K, Ba, or Mg and (b) double bond monomer is 1,3-butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene, 2-methyl-1,3-pentadiene, 2,3-dimethyl-1,3-pentadiene, 2-phenyl-1,3-butadiene, 4,5-diethyl-1,3-octadiene, styrene, 1-ethylene naphthalene, 3-methylstyrene, 3,5-diethylstyrene, 4-propylstyrene, 2,4,6-trimethylstyrene, 4-dodecylstyrene, 3-methyl-5-n-hexylstyrene, 4-phenylstyrene, 2-ethyl-4-benzylstyrene, 3,5-diphenylstyrene, 2,3,4,5-tetraethyl styrene, 3-ethyl-1-vinylnaphthalene, 6-isopropyl-1-vinylnaphthalene, 6-cyclohexyl-1-vinylnaphthalene, 7-dodecyl-2-vinylnaphthalene, α-methyl styrene, or a combination thereof.

A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): ##STR00001## in formula (I), t is an integer ranging from 2 to 6,
wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.

A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.

A primer composition and a copper foil substrate using the same are provided. The primer composition includes a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds, wherein a molar ratio of the hydrocarbon resin to the compound having three or more carbon-carbon double bonds is 1:0.2 to 1:10.

A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.

Copper clad laminates and a resin composition and a pre-preg and a laminate using the composition. The resin composition contains: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. Employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem.