To provide a method of manufacturing an electrical contactor including a volute spring structure extending in upward and downward directions formed integrally using a single material, having mechanical simplicity and excellent functionality, and functioning as an electric circuit achieving connection without loss. The present disclosure is intended for a method of manufacturing an electrical contactor made of a plate-like member having electrical conductivity, comprising: (1) a first step of forming the plate-like member into a barrel shape by winding the plate-like member in a spiral pattern; (2) a second step of compressing the plate-like member formed into the barrel shape from a vertical direction until the plate-like member assumes a volute shape with an upper spiral structure and a lower spiral structure overlapping each other; and (3) a third step of forming a volute-shaped electrical contactor by performing predetermined hardening treatment on the plate-like member temporarily assuming the volute shape as a result of the second step.

Disclosed is a test socket supporting a probe. The test socket includes a socket block of an insulating material, provided with a probe hole to accommodate the probe, and a coating portion comprising an external film of a conductive material coated on an outer surface of the socket block, and an internal film of a conductive material coated on an inner surface of the probe hole, at least a portion of the internal film being electrically isolated from the external film.

Disclosed is a test socket supporting a probe. The test socket includes a socket block of an insulating material, provided with a probe hole to accommodate the probe, and a coating portion comprising an external film of a conductive material coated on an outer surface of the socket block, and an internal film of a conductive material coated on an inner surface of the probe hole, at least a portion of the internal film being electrically isolated from the external film.

Because reprocessing or refurbishing of physiological sensors reuses large portions of an existing sensor, the material costs for refurbishing sensors is significantly lower than the material costs for making an entirely new sensor. Typically, existing reprocessors replace only the adhesive portion of an adhesive physiological sensor and reuse the sensing components. However, re-using the sensing components can reduce the reliability of the refurbished sensor and/or reduce the number of sensors eligible for refurbishing due to out-of-specification sensor components. It is therefore desirable to provide a process for refurbishing physiological sensors that replaces the sensing components of the sensor. While sensing components are replaced, generally, sensor cable and/or patient monitor attachments are retained, resulting in cost savings over producing new sensors.

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die tow the upper die by a plate. The probe pin is picked from the probe head by an arm.

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die tow the upper die by a plate. The probe pin is picked from the probe head by an arm.

To guarantee positioning of an elastic pin during manufacturing without using a guide member, and to prevent contamination from a guide member in a final product. An electronic device inspection socket having a plurality of elastic pins each having the center portion embedded in, and having respective ends projecting from, an insulator which changes, through solidification, from a fluid state to a solid but deformable state, wherein the leading ends of the elastic pins are portions received by a plurality of recesses provided to a device for manufacturing the electronic device inspection socket, and the insulator is a portion formed after being injected in a fluid state between said respective ends in a state where said respective ends are received in the recesses and being solidified.

A probe chip consisting of multiple probes integrated on a single substrate. The layout of the probes could be designed to match specific features on the device under test. The probes are spring-loaded to allow for reversible deformation during contacting of the device under test. The probe chip provides for detailed electrical and mechanical testing of integrated circuits (IC).

A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.

A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.