A laminated structure includes a cooling member; a circuit board provided on the cooling member and having a through hole; a device provided on the circuit board and including a quantum bit; and a bonding material configured to bond together the circuit board and the device. The bonding material includes a first bonding portion contacting a portion of an upper surface of the cooling member exposed from the through hole, an upper surface of the circuit board, and a lower surface of the device; and a second bonding portion provided around the first bonding portion in plan view and contacting the upper surface of the circuit board and the lower surface of the device. A thermal conductivity of the first bonding portion is higher than that of the second bonding portion. An elastic modulus of the second bonding portion is lower than that of the first bonding portion.

An electronic system is disclosed. In one example, the electronic system comprises an at least partially electrically conductive carrier, an electronic component, and an intermetallic connection structure connecting the carrier and the component. The intermetallic connection structure comprising an intermetallic mesh structure in a central portion of the intermetallic connection structure, and opposing exterior structures without intermetallic mesh and each arranged between the intermetallic mesh structure and the carrier or the component.