Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.

Provided is a chamber system for solid free form fabrication, the chamber system having a deposition chamber, a service chamber and one or more loading/unloading chambers. The chamber system allows for a more efficient and cost effective process to service the deposition apparatus, load holding substrates, and unload workpieces without requiring having to adjust the atmosphere in the deposition chamber.

Provided is a chamber system for solid free form fabrication, the chamber system having a deposition chamber, a service chamber and one or more loading/unloading chambers. The chamber system allows for a more efficient and cost effective process to service the deposition apparatus, load holding substrates, and unload workpieces without requiring having to adjust the atmosphere in the deposition chamber.

So as to perform a vacuum surface treatment on a workpiece at a predetermined temperature, which is different from a temperature to which the surface is exposed during the vacuum surface treatment, the workpiece is conveyed in a conveyance direction along one or more than one station group including one or more than one tempering station and of a single treatment station.

Whenever substrates are rotationally and continuously conveyed in a vacuum recipient around a common axis and past a magnetron sputter source, sputtering of the target, rotating around a central target axis, by the stationary magnetron plasma is adapted to the azimuthal extents radially differently spaced areas of the substrates become exposed to the target thereby improving homogeneity of deposited layer thickness on the substrates and ensuring that the complete sputter surface of the target is net-sputtered.

A system is described herein for film deposition includes a drum; a motor configured to rotate the drum in a direction of rotation; a target including a target material; and a holder attached to the drum. The holder is configured to accommodate a substrate and to expose the substrate to free particles of the target material sputtered from the target, and the holder has an asymmetric shape.

A stage for heating and cooling an object installed in a chamber 1 includes : a stage body 5, 6 that has a mounting surface on which an object is mounted; a heating unit 7 for heating the mounting surface; and a cooling unit 8 for cooling the mounting surface. The stage body 5, 6 also has a first groove 10 into which the heating unit is inserted and a second groove 10 into which the cooling unit is inserted. The gap between the first groove and the heating unit and the gap between the second groove and the cooling unit have a heat-conductive medium.

A holder (10) for holding a substrate (L) during vacuum coating comprises a base body (12) with a masking portion (14) provided with an opening (16) adapted to receive the substrate. The opening in the masking portion is shaped to correspond to or closely match the shape of the substrate to be held without substantial gaps therebetween. The masking portion is provided with a slot (22) that extends radially outward from an inner edge (18) of the opening. A narrow spring arm of a spring arrangement mounted to the holder is received in the slot and adapted to resiliently bear against an outer edge (E) of the substrate to urge the substrate toward a support area (24) at the inner edge of the opening on a side opposite said slot. Further, a loading/unloading device (60) for loading the substrate into such holder and for unloading it therefrom is proposed.

A holder (10) for holding a substrate (L) during vacuum coating comprises a base body (12) with a masking portion (14) provided with an opening (16) adapted to receive the substrate. The opening in the masking portion is shaped to correspond to or closely match the shape of the substrate to be held without substantial gaps therebetween. The masking portion is provided with a slot (22) that extends radially outward from an inner edge (18) of the opening. A narrow spring arm of a spring arrangement mounted to the holder is received in the slot and adapted to resiliently bear against an outer edge (E) of the substrate to urge the substrate toward a support area (24) at the inner edge of the opening on a side opposite said slot. Further, a loading/unloading device (60) for loading the substrate into such holder and for unloading it therefrom is proposed.

A film forming apparatus has a process chamber and a processing unit provided in the process chamber and forming adhesive film. The surface of the inner walls of the process chamber is formed of a material having a large getter effect on gas or water (H.sub.2O) remaining in the process chamber.