C23C14/50

Method and apparatus for controlling stress variation in a material layer formed via pulsed DC physical vapor deposition

A method and apparatus are for controlling stress variation in a material layer formed via pulsed DC physical vapour deposition. The method includes the steps of providing a chamber having a target from which the material layer is formed and a substrate upon which the material layer is formable, and subsequently introducing a gas within the chamber. The method further includes generating a plasma within the chamber and applying a first magnetic field proximate the target to substantially localise the plasma adjacent the target. An RF bias is applied to the substrate to attract gas ions from the plasma toward the substrate and a second magnetic field is applied proximate the substrate to steer gas ions from the plasma to selective regions upon the material layer formed on the substrate.

Method and apparatus for controlling stress variation in a material layer formed via pulsed DC physical vapor deposition

A method and apparatus are for controlling stress variation in a material layer formed via pulsed DC physical vapour deposition. The method includes the steps of providing a chamber having a target from which the material layer is formed and a substrate upon which the material layer is formable, and subsequently introducing a gas within the chamber. The method further includes generating a plasma within the chamber and applying a first magnetic field proximate the target to substantially localise the plasma adjacent the target. An RF bias is applied to the substrate to attract gas ions from the plasma toward the substrate and a second magnetic field is applied proximate the substrate to steer gas ions from the plasma to selective regions upon the material layer formed on the substrate.

Method of coating substrates

The disclosure relates to a method of determining a velocity profile for the movement of a substrate to be coated relative to a coating source.

WEAR RESISTANT COATING FOR BRAKE DISKS WITH UNIQUE SURFACE APPEARANCE AND METHODS FOR COATING
20220381307 · 2022-12-01 ·

A brake disk including carbon steel, stainless steel or a ceramic composite material and coated with a coating material that is wear and corrosion resistant and when applied properly allows for the coated surface to have a variety of “textured” appearances. For example, the coated surface can be made to look like woven carbon fiber. The aesthetically pleasing, wear and corrosion resistant coating overlays wear surfaces and portions of the brake disk that will be, in many cases, visible when the brake disk is installed on the vehicle. The coating includes a first layer of a metal, such as a pure titanium metal, and a second layer that can include a Nitride, Boride, Carbide or Oxide of the metal used in the first layer. The coating can be applied using a physical vapor deposition source such as a cathodic arc source with a controlled gas atmosphere.

SPUTTER DEPOSITION APPARATUS AND METHOD

Certain examples described herein relate to a sputter deposition apparatus including a substrate holder, a target loader, a plasma source to generate a plasma, and a magnet arrangement. The substrate holder is to position a substrate in a sputter deposition zone for sputter deposition of target material from a first target to the substrate in use. The target loader is to move a second target from a target priming zone into the sputter deposition zone for sputter deposition of target material from the second target to the substrate in use. The magnet arrangement configured to confine the plasma within the apparatus to the target priming zone and the sputter deposition zone. Within the target priming zone, a respective target is exposed to the plasma in use. The sputter deposition zone provides for sputter deposition of target material.

SPUTTER DEPOSITION APPARATUS AND METHOD

Certain examples described herein relate to a sputter deposition apparatus including a substrate holder, a target loader, a plasma source to generate a plasma, and a magnet arrangement. The substrate holder is to position a substrate in a sputter deposition zone for sputter deposition of target material from a first target to the substrate in use. The target loader is to move a second target from a target priming zone into the sputter deposition zone for sputter deposition of target material from the second target to the substrate in use. The magnet arrangement configured to confine the plasma within the apparatus to the target priming zone and the sputter deposition zone. Within the target priming zone, a respective target is exposed to the plasma in use. The sputter deposition zone provides for sputter deposition of target material.

SPUTTER DEPOSITION

A sputter deposition apparatus including: a substrate support assembly arranged to support a substrate; a target support assembly arranged to support at least one sputter target for use in a sputter deposition of a target material onto the substrate; a plasma generation arrangement arranged to provide plasma for said sputter deposition; and a cartridge arranged to contain the substrate with deposited target material after said sputter deposition. The cartridge is removable from the sputter deposition apparatus.

SPUTTER DEPOSITION

A sputter deposition apparatus including: a substrate support assembly arranged to support a substrate; a target support assembly arranged to support at least one sputter target for use in a sputter deposition of a target material onto the substrate; a plasma generation arrangement arranged to provide plasma for said sputter deposition; and a cartridge arranged to contain the substrate with deposited target material after said sputter deposition. The cartridge is removable from the sputter deposition apparatus.

FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING
20220380886 · 2022-12-01 ·

Embodiments of the present disclosure provide a substrate processing system. In one embodiment, the system includes a chamber, a target disposed within the chamber, a magnetron disposed proximate the target, a pedestal disposed within the chamber, and a first gas injector disposed at a sidewall of the chamber, the first gas injector having a movable gas outlet.

FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING
20220380886 · 2022-12-01 ·

Embodiments of the present disclosure provide a substrate processing system. In one embodiment, the system includes a chamber, a target disposed within the chamber, a magnetron disposed proximate the target, a pedestal disposed within the chamber, and a first gas injector disposed at a sidewall of the chamber, the first gas injector having a movable gas outlet.