C09D5/4496

TRANSPARENT COATING FILM FORMING COMPOSITION
20200199406 · 2020-06-25 · ·

A transparent coating film forming composition contains: (A) a polysilazane having units represented by the following formulae (1) and (2), and having predetermined modification rate and weight average molecular weight,

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(B) an organic solvent containing (B-1) and (B-2), (B-1) an organic solvent having a dielectric constant of 2.1 to 15.0 on average and a higher boiling point under atmospheric pressure (1013 hPa) than that of an organic solvent contained as the component (B-2), and (B-2) a saturated aliphatic hydrocarbon organic solvent; and (C) a predetermined curing catalyst. The mixing ratio of the component (A) and the component (B) satisfies a predetermined range. This provides a transparent coating film forming composition using an organic solvent having high polysilazane solubility, volatility at an appropriate speed during application, high safety and workability, the composition enabling formation of a coating film that is uniform and has high transparency and hardness after curing.

THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING AND/OR FIRE-RETARDANT ELECTRODEPOSITABLE COATING COMPOSITIONS

The present invention is directed towards an electrodepositable coating composition comprising an electrodepositable binder; and a thermally conductive, electrically insulative filler, a fire-retardant pigment, or a combination thereof. Also disclosed are methods of making the electrodepositable coating composition, coatings, and coated substrates.

Method for preparing cationic electrodeposition coating composition

The objective of the present invention is to provide a method for preparing a cationic electrodeposition coating composition that contains a bismuth compound and exhibits excellent coating material stability, curability, coating film appearance and the like. The present invention provides a method for preparing a cationic electrodeposition coating composition, which comprises a step for mixing a resin emulsion (i) and a pigment-dispersed paste, and wherein: the resin emulsion (i) contains an aminated resin (A) and a blocked isocyanate curing agent (B); the pigment-dispersed paste contains a bismuth mixture (C) that is obtained by mixing a bismuth compound (c1) and an organic acid (c2) in advance, a pigment-dispersed resin (D), an amine-modified epoxy resin emulsion (ii) that contains an amine-modified epoxy resin (E), and a pigment (F); the pigment-dispersed resin (D) has a hydroxyl number of 20-120 mgKOH/g; and the amine-modified epoxy resin (E) has a hydroxyl number of 150-650 mgKOH/g.

Electrodepositable coating composition having improved crater control

The present invention is directed towards an electrodepositable coating composition comprising a polyamine-dialdehyde adduct comprising a polymerization product of a polyamine and a dialdehyde. Also disclosed are methods of making the electrodepositable coating composition, methods of coating a substrate, and substrates treated with the electrodepositable coating composition.

Cationic electrodeposition coating composition and method for electrodeposition coating

The present disclosure is a cationic electrodeposition coating composition comprising an emulsion particle (A) containing a Michael addition reaction donor component and an emulsion particle (B) containing a Michael addition reaction acceptor component wherein a Michael addition reaction catalyst (C) is contained in the emulsion particle (A) or the emulsion particle (B) or is contained in the cationic electrodeposition coating composition by being microencapsulated.

Aqueous dip-coating composition for electroconductive substrates, comprising dissolved bismuth

The present invention relates to an aqueous coating composition (A) having a pH in a range from 4.0 to 6.5 and comprising at least one cathodically depositable binder (A1), a total amount of at least 130 ppm of Bi, based on the total weight of (A), including at least 30 ppm of Bi in a form (A3) in solution in (A) and optionally at least 100 ppm of Bi in a form (A4) not in solution in (A), and at least one at least bidentate complexing agent (A5) suitable for complexing Bi, (A5) being a compound of the general formula (1) or an anion of this compound, for at least partly coating an electrically conductive substrate with an electrocoat material, to a method for producing (A), to the use of (A) for at least partly coating an electrically conductive substrate with an electrocoat material, to a corresponding coating method, to an at least partly coated substrate obtainable by this method, and to a method for setting and/or maintaining the concentration of component (A3) and/or optionally (A4) in the coating composition (A) during the coating method.

METHOD FOR PREPARING CATIONIC ELECTRODEPOSITION COATING COMPOSITION

The objective of the present invention is to provide a method for preparing a cationic electrodeposition coating composition that contains a bismuth compound and exhibits excellent coating material stability, curability, coating film appearance and the like. The present invention provides a method for preparing a cationic electrodeposition coating composition, which comprises a step for mixing a resin emulsion (i) and a pigment-dispersed paste, and wherein: the resin emulsion (i) contains an aminated resin (A) and a blocked isocyanate curing agent (B); the pigment-dispersed paste contains a bismuth mixture (C) that is obtained by mixing a bismuth compound (c1) and an organic acid (c2) in advance, a pigment-dispersed resin (D), an amine-modified epoxy resin emulsion (ii) that contains an amine-modified epoxy resin (E), and a pigment (F); the pigment-dispersed resin (D) has a hydroxyl number of 20-120 mgKOH/g; and the amine-modified epoxy resin (E) has a hydroxyl number of 150-650 mgKOH/g.

Electrodeposition coating material composition and catalyst for electrodeposition coating material

Provided is an organic tin-free cationic electrodeposition coating composition which does not contain organic tin compound and can sustain a superior coating curability under currently used baking conditions, and to a catalyst for the composition. A catalyst for electrodeposition coating composition containing a bismuth compound (A), wherein: the bismuth compound is a compound having a ligand prepared from a -diketone represented by Chemical Formula (1) is provided. ##STR00001##
(wherein, a plurality of R.sup.1 are the same or different from each other and represent a hydrocarbon group, and a number of total carbon atoms in two R.sup.1 is 4 or larger)

ELECTRODEPOSITION COATING MATERIAL COMPOSITION AND CATALYST FOR ELECTRODEPOSITION COATING MATERIAL

Provided is an organic tin-free cationic electrodeposition coating composition which does not contain organic tin compound and can sustain a superior coating curability under currently used baking conditions, and to a catalyst for the composition. A catalyst for electrodeposition coating composition containing a bismuth compound (A), wherein: the bismuth compound is a compound having a ligand prepared from a -diketone represented by Chemical Formula (1) is provided.

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(wherein, a plurality of R.sup.1 are the same or different from each other and represent a hydrocarbon group, and a number of total carbon atoms in two R.sup.1 is 4 or larger)

Use Of Bismuth Subnitrate In Electro-Dipping Paints

Cathodically depositable electrocoat materials comprising basic bismuth nitrate, further comprising at least one binder having reactive functional groups and at least one crosslinker containing the complementary reactive functional groups which are able to enter into thermal crosslinking reactions.