A fusing fabric may be used for thermal fusion of a plurality of plies of fabric. The fusing fabric contains at least partially fusible fibers containing a resin that has a melting point of 150° C. or lower or a softening point of 110° C. or lower, and has an air permeability of 1000 cm.sup.3/cm.sup.2.Math.s or more to 10000 cm.sup.3/cm.sup.2.Math.s or less.

A fusing fabric may be used for thermal fusion of a plurality of plies of fabric. The fusing fabric contains at least partially fusible fibers containing a resin that has a melting point of 150° C. or lower or a softening point of 110° C. or lower, and has an air permeability of 1000 cm.sup.3/cm.sup.2.Math.s or more to 10000 cm.sup.3/cm.sup.2.Math.s or less.

Nylon staple fiber with additive exhibiting a break tenacity greater than 6.5 g/den are provided as well as yarns, fabrics and other articles of manufacture produced from the fiber. Methods for producing the nylon staple fiber with additive are also provided.

Nylon staple fiber with additive exhibiting a break tenacity greater than 6.5 g/den are provided as well as yarns, fabrics and other articles of manufacture produced from the fiber. Methods for producing the nylon staple fiber with additive are also provided.

A nonwoven composite for high temperature applications requiring Sow flammability, smoke, and/or toxicity, including a fibrous structure having one or more nonwoven material layers including a scrim layer. The scrim is formed from inorganic fibers, at least some of which are adapted to withstand temperatures of up to about 1150 C. The scrim is formed from a wet-laying process. The composite further comprises one or more fiber matrix layers.

An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.