Patent classifications
F25B35/04
INTELLIGENT COOLING SYSTEM
Disclosed are systems and methods of intelligently cooling thermal loads by providing a burst mode cooling system for rapid cooling, and an auxiliary cooling system that controls the temperature of the thermal load and surrounding environment between burst mode cooling cycles.
Adsorber, Method for Producing an Adsorber, and Vehicle Comprising an Adsorber
An adsorber for a vehicle is provided. The adsorber includes a housing, in which a sorbent is arranged for storing heat and for dispensing stored heat. The adsorber also includes a heat exchanger which is arranged within the housing, has a wall that encloses a cavity for conducting a heating medium, and has an outer surface that contacts the sorbent for exchanging heat. By virtue of a special design of the heat exchanger, the sorbent and the arrangement thereof relative to each other, a particularly high power density and heat storage capacity are achieved. A method for producing the adsorber and a vehicle which has an adsorption system including such an adsorber are also provided.
Adsorber, Method for Producing an Adsorber, and Vehicle Comprising an Adsorber
An adsorber for a vehicle is provided. The adsorber includes a housing, in which a sorbent is arranged for storing heat and for dispensing stored heat. The adsorber also includes a heat exchanger which is arranged within the housing, has a wall that encloses a cavity for conducting a heating medium, and has an outer surface that contacts the sorbent for exchanging heat. By virtue of a special design of the heat exchanger, the sorbent and the arrangement thereof relative to each other, a particularly high power density and heat storage capacity are achieved. A method for producing the adsorber and a vehicle which has an adsorption system including such an adsorber are also provided.
Adsorption heat exchanger devices
Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.
Adsorption heat exchanger devices
Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.
METHOD FOR PREPARING ADSORPTION DEVICE
Problem To suppress the distribution of adsorption materials and binders between a heat-transfer member and a heat-transfer member from being disproportioned.
SOLUTION TO PROBLEM There is provided a method for preparinq an adsorption device in which activated carbons are held in an area of accommodating a plurality of heat-transfer members 34 arranged by intervals with each other in a main body part 31. The method includes a filling step (step 102) for filling a slurry filler 45, in which porous particles 41 and binder resins 42 are dispersed in a solvent 46, into the area , to fill the filler 45 into at least a clearance S between the heat-transfer member 34 and the heat-transfer member 34, an evaporating step (step 103) for heating the main body part 31 in which the filler 45 is filled in the area in a first-temperature range to evaporate the solvent 46, and a hardening step (step 104) for heating the main body part 31 in which the solvent 46 is evaporated in the evaporating step (step 103) in a second temperature range higher than the first temperature range to harden the binder resins 42.
METHOD FOR PREPARING ADSORPTION DEVICE
Problem To suppress the distribution of adsorption materials and binders between a heat-transfer member and a heat-transfer member from being disproportioned.
SOLUTION TO PROBLEM There is provided a method for preparinq an adsorption device in which activated carbons are held in an area of accommodating a plurality of heat-transfer members 34 arranged by intervals with each other in a main body part 31. The method includes a filling step (step 102) for filling a slurry filler 45, in which porous particles 41 and binder resins 42 are dispersed in a solvent 46, into the area , to fill the filler 45 into at least a clearance S between the heat-transfer member 34 and the heat-transfer member 34, an evaporating step (step 103) for heating the main body part 31 in which the filler 45 is filled in the area in a first-temperature range to evaporate the solvent 46, and a hardening step (step 104) for heating the main body part 31 in which the solvent 46 is evaporated in the evaporating step (step 103) in a second temperature range higher than the first temperature range to harden the binder resins 42.
Method for the production of a heat exchanger, particularly a sorption heat exchanger
A method for the production of a heat exchanger is provided, particularly a sorption heat exchanger, in which several components of the heat exchanger have a ferrous based material, such as pipes, the pipes finishing the bottoms, and the bottoms and the pipes enclosing the housing components are coffered and then soldered. In one method, which reliably realizes the soldering of the joints with different widths, a brazing foil is introduced during the coffering of the components of the heat exchanger formed of steel or stainless steel between the joints of the components of the heat exchanger, and then the joints are filled with a low-melting solder and soldered without flux material.
Molecular Sieve Chamber
A molecular sieve chamber comprises a plurality of containers generally parallel to another and arranged in a matrix having adjacent rows that may be offset from one another. The plurality of containers may be spaced from one another forming a plurality of tortuous air passages from a first side of the molecular sieve chamber to a second side of the molecular sieve chamber opposite the first side. Each of the plurality of containers may include a venting passage having a plurality of apertures, and at least one molecular sieve positioned between the venting passage and a solid sidewall. A fan may be configured to blow air between the plurality of containers in a direction generally perpendicular to a longitudinal axis of the plurality of containers. The venting passages of each of the plurality of containers may be fluidly coupled to one another.
Molecular Sieve Chamber
A molecular sieve chamber comprises a plurality of containers generally parallel to another and arranged in a matrix having adjacent rows that may be offset from one another. The plurality of containers may be spaced from one another forming a plurality of tortuous air passages from a first side of the molecular sieve chamber to a second side of the molecular sieve chamber opposite the first side. Each of the plurality of containers may include a venting passage having a plurality of apertures, and at least one molecular sieve positioned between the venting passage and a solid sidewall. A fan may be configured to blow air between the plurality of containers in a direction generally perpendicular to a longitudinal axis of the plurality of containers. The venting passages of each of the plurality of containers may be fluidly coupled to one another.