In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.

A physical quantity measuring device includes: a sensor module provided with a diaphragm; a joint to which the sensor module is attached, the joint including a pressure inlet for delivering fluid to be measured to the sensor module. The joint is made of a synthetic resin and includes a joint body and an elastically deformable claw provided to the joint body and configured to lock the sensor module. Since the claw keeps the sensor module to be held by virtue of the elastic force of the claw, a further attachment process such as welding for attaching the sensor module to the joint is unnecessary. Since the joint body and the claw are integrally made of synthetic resin, it is not necessary to separately manufacture the joint body and the claw.

In an embodiment, a pressure sensor includes a tip secured to a port. The tip includes an opening for receiving pressure to be measured by the pressure sensor. The port includes a threaded section for mounting the pressure sensor in a fixture such as, for example, a rail. The port also includes a flexible section, a cavity, and an opening. The opening in the tip receives pressure from an outside source and channels the pressure to the opening of the port. The opening of the port receives the pressure from the tip and channels the pressure to the cavity. The pressure received in the cavity applies a force to the flexible section which flexes in response to the force. Moreover, forces are provided by the tip and the threaded section to keep the tip secured to the port.

According to one embodiment, a strain sensing element provided on a deformable substrate includes: a first magnetic layer; a second magnetic layer; a spacer layer; and a bias layer. Magnetization of the second magnetic layer changes according to deformation of the substrate. The spacer layer is provided between the first magnetic layer and the second magnetic layer. The second magnetic layer is provided between the spacer layer and the bias layer. The bias layer is configured to apply a bias to the second magnetic layer.

According to one embodiment, a strain sensing element provided on a deformable substrate includes: a first magnetic layer; a second magnetic layer; a spacer layer; and a bias layer. Magnetization of the second magnetic layer changes according to deformation of the substrate. The spacer layer is provided between the first magnetic layer and the second magnetic layer. The second magnetic layer is provided between the spacer layer and the bias layer. The bias layer is configured to apply a bias to the second magnetic layer.

A semiconductor structure includes a substrate including a plurality of vias passing through the substrate and filled with a conductive or semiconductive material, and an oxide layer surrounding the conductive or semiconductive material, the substrate defining a cavity therein; a membrane disposed over the substrate and the cavity; a heater disposed within the membrane and electrically connected with the substrate; and a sensing electrode disposed over the membrane and the heater.

A process fluid pressure sensor assembly includes a pressure sensor configured to sense a pressure of a process fluid. The assembly includes a pressure sensor body formed of an insulating material. The pressure sensor includes a plurality of electrical contact pads which couple to a pressure sensing element of the body of the pressure sensor. An interconnect body is configured to fit over an end of the pressure sensor body. A plurality of electrical connectors carried in the interconnect body are in electrical contact with the plurality of electrical contact pads. A wiring harness attaches to the interconnect body and includes a plurality of wires which are electrically connected to the plurality of electrical connectors.

Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.

A pressure sensor includes a base having a high-pressure contact portion, and a diaphragm positioned over the base and having an external top surface opposite the base. The external top surface is defined within a closed perimeter and external side surfaces extend down from an entirety of the closed perimeter toward the base. A high-pressure contact portion of the diaphragm is aligned with and separated by a gap from the high-pressure contact portion of the base. A sensing element is coupled to the diaphragm and provides an output based on changes to the diaphragm. When a hydrostatic pressure load above a threshold value is applied to the entire external top surface and external side surfaces of the diaphragm, the hydrostatic pressure load causes the high-pressure contact portion of the diaphragm to contact the high-pressure contact portion of the base.

A pressure sensor includes a pressure sensor element, a joint provided to a target member, and an attachment member that is fitted into the joint through the connection section and connected to the target member. Each of the pressure sensor element and the joint is formed of a material that is not embrittled upon being in contact with a fluid to be measured that embrittles a material, and more rigid than the attachment member. The connection section is subjected to a plastic deformation connection (metal flow). An expensive hydrogen embrittlement resistant material is used for the pressure sensor element and the joint that are brought into contact with the fluid to be measured, and an inexpensive material is used for the attachment member that is not brought into contact with the fluid to be measured, thereby reducing the production cost of the pressure sensor.