A pressure sensor package includes a pressure sensor having a first side attached to a substrate and a second side opposite the first side, the first side having a pressure inlet aligned with an opening in the substrate, the second side having one or more electrical contacts. A logic die attached to an opposite side of the substrate as the pressure sensor is operable to process signals from the pressure sensor. First electrical conductors connect to the one or more electrical contacts of the pressure sensor. Second electrical conductors connect to one or more electrical contacts of the logic die. A mold compound completely encapsulates the second electrical conductors and at least partly encapsulates the logic die and the first electrical conductors. An open passage in the mold compound is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package.

According to one embodiment, a pressure sensor includes a film portion, a sensor unit, and a structure body. The film portion has a front surface and is deformable. The sensor unit includes a plurality of sensing elements arranged along the front surface. One of the plurality of sensing elements includes a magnetic layer, a opposing magnetic layer, and a nonmagnetic intermediate layer. The structure body is arranged with the first sensor unit along the arrangement direction of the plurality of sensing elements. The structure body includes a structure body layer, a opposing structure body layer, and a intermediate structure body layer. The structure body layer has at least one of a floating potential with respect to the opposing structure body layer or same potential as a potential of the opposing structure body layer.

A surface acoustic wave (SAW) sensor includes a surface acoustic wave material and a comb-teeth electrode. The surface acoustic wave material is to be arranged at a place where the surface acoustic wave material is distorted by physical quantity such as stress. The comb-teeth electrode is arranged on the surface of the surface acoustic wave material to excite a surface acoustic wave to the surface acoustic wave material. The surface acoustic wave material has a sapphire board and a ScAlN film arranged on a surface of the sapphire board.

The present invention provides a functional film structure and a method of manufacturing the same. The functional film structure has a sensor button arranged on a film substrate and can be formed into a three-dimensional shape by thermal forming processes such as vacuum deep-drawing or high-pressure moulding. The functional film structure is preferably flexible and preferably has transparent and illuminated sections.

A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.

In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.

A pressure sensor includes: a pressure sensor element; a metal adapter integrally attached to the pressure sensor element and defining therein a hole through which a pressure of a fluid to be measured is introduced to the pressure sensor element; a metal fitting member provided with a housing recess receiving the adapter and connectable to a connected member; and an operation member pressing a valve provided to the connected member and defining a communicating path through which a flow path, in which the pressure of the fluid to be measured is introduced, is in communication with the hole of the adapter. The adapter and the fitting member are connected to each other by plastic deformation. The operation member is a synthetic resin member including: a contact portion brought into contact with the adapter; and a pressing portion provided on a side opposite to the contact portion to press the valve.

Aspects of the subject technology relate to an apparatus including multiple cavities disposed adjacent to one another in a housing structure. The apparatus further includes a number of membranes, with each membrane disposed over a cavity to seal the cavity, and a sensor that can sense a deflection of a respective membrane associated with one of the cavities in response to an applied pressure. Each membrane is operable within a respective pressure range, and the applied pressure is within an operating range of the respective membrane.

The present invention provides a sensor system for measuring a parameter (e.g. volume, temperature or pressure) of a target, the system comprising a diaphragm, a sensor for measuring the axial spacing between the sensor and the diaphragm, and an axially adjustable mount. The mount has a first axial end for mounting the diaphragm which is axially movable relative to the sensor and an opposing, second axial end which is axially fixed relative to the sensor. The diaphragm and mount define a chamber for receiving the target or for being received within the target. In use, the axial spacing between the first axial end and the second axial end of the mount and thus the axial spacing between the diaphragm and sensor varies as a result of a change in the parameter differential across the diaphragm.