A sealing pin includes a body part and an end part connected to the body part. The body part is insertable into a liquid filling path of a pressure sensor. The body part has a groove on an outer surface. The end part seals a liquid filling port of the liquid filling path. When the sealing pin is inserted into the liquid filling path, an external media pressure applied to a diaphragm of the pressure sensor is transmitted to a pressure detection chip of the pressure sensor through a liquid in the groove.

A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.

Disclosed herein are various techniques and devices for detecting a level of fluid within a fluid collection receptacle. These techniques and devices may further determine a flow rate of fluid entering the fluid collection receptacle or a volume of fluid collected within the fluid collection receptacle. Sensors, including pressure sensors, may be installed in, on, or within the fluid collection receptacle to detect information about the liquid within the receptacle including fluid level, flow rate, and volume.

A sensor includes a sensing element for detecting a property and/or a composition of a surrounding medium of the sensor, a transmission medium for transmitting a property and/or a composition of the surroundings medium onto the sensing element, the transmission medium being situated in such a way that the transmission medium is applied to the sensing element, and a cover, which distances the transmission medium from the surrounding medium, the cover being manufactured from a self-healing material, in particular, the cover being designed as a flexible membrane which is made up of a self-healing material.

A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires forming electrodes, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit by measuring a capacitance between the electrodes and by detecting a change between the measured capacitance and a capacitance between the electrodes in absence of moisture.

The invention relates to a sensor arrangement (10) for measuring the pressure and temperature of a fluid, the sensor arrangement (10) including a housing (12), a pressure sensor element (18), and a temperature sensor case (20), wherein the housing (12) includes a passage (22) and a fluid opening (24), the passage (22) and the fluid opening (24) being in fluid communication, wherein the pressure sensor element (18) is connected to the housing (12), the pressure sensor element (18) being in fluid communication with the passage (22), wherein the temperature sensor case (20) includes at least one temperature sensor element (30), the temperature sensor case (20) being at least partially arranged in the passage (22), wherein the sensor arrangement (10) further includes an attachment element (26), wherein the attachment element (26) attaches the temperature sensor case (20) to the passage (22), wherein the sensor arrangement (10) further includes a fluid channel (28) extending at least in part between the housing (12) and the temperature sensor case (20), the fluid channel (28) passing the attachment element (26) and being in fluid communication with the fluid opening (24) and the pressure sensor element (18). The invention provides an improved sensor arrangement (10) for measuring the pressure and temperature of a fluid that includes a reduced size and is cost-efficient.

A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

An article for use in a plasma processing apparatus includes a gas supply pipe, and a component disposed in the gas supply pipe. The component is configured to cause radicals of gas passing through the gas supply pipe to be deactivated in the component.

Disclosed herein are various techniques and devices for detecting a level of fluid within a fluid collection receptacle. These techniques and devices may further determine a flow rate of fluid entering the fluid collection receptacle or a volume of fluid collected within the fluid collection receptacle. Sensors, including pressure sensors, may be installed in, on, or within the fluid collection receptacle to detect information about the liquid within the receptacle including fluid level, flow rate, and volume.