A board main body of a board has a sensor mounting area, in which a physical quantity sensor is mounted, disposed on a surface. A non-electrode forming part and a plurality of electrodes are disposed in the sensor mounting area, the electrodes being disposed so as to be isolated from each other, and to correspond to mounting terminals of the physical quantity sensor. A shield electrode is disposed outside the sensor mounting area.

A sensor unit includes a sensor and a mount board on which the sensor is mounted. The mount board includes a mount terminal connected to a terminal provided in the sensor and a wiring extending from the mount terminal. The wiring is not provided in a region where the sensor and the mount board overlap each other when viewed in plan.

Techniques of manufacturing an accelerometer as disclosed herein include positioning an accelerometer between a first stator and a second stator, and the accelerometer comprises a plurality of features. In some examples, the plurality of features include a proof mass, a support structure defining a plane and configured to support the proof mass, a flexure configured to flexibly connect the proof mass to the support structure, and a plurality of raised pads, the plurality comprising at least one raised pad positioned between the flexure and an exterior of the support structure, wherein the at least one raised pad is configured to be isolatable. Techniques of manufacturing the accelerometer as disclosed herein further include compressing the first stator and the second stator onto the accelerometer, attaching a bellyband to the first stator and the second stator, and isolating the at least one raised pad.

Abnormalities of multiple sensors with redundancy are detected with higher accuracy. A semiconductor device according to the present invention includes: a plurality of internal sensors that detect an identical object to be detected; a switching circuit that switches detection signals from the internal sensors at a predetermined frequency and outputs the signals; a correction information extracting circuit that extracts a first frequency component for correcting the output signal of a predetermined external sensor, from a converted signal based on an output of the switching circuit; and an abnormality information extracting circuit that extracts a second frequency component for detecting abnormalities of the internal sensors, from the converted signal based on the output of the switching circuit.

A sensor may be compensated by selectively activating a temperature element to drive temperature within the thermal envelope encompassing the sensor towards an operating temperature and applying a compensation to output of the sensor based at least in part on the operating temperature. The initial ambient temperature may be estimated and the operating temperature may be selected from a set of predetermined temperatures based on the estimate. The current ambient temperature may be estimated and a new operating temperature selected when the current ambient temperature is within a threshold of the operating temperature. Correspondingly, the temperature element may be selectively activated to drive temperature within the thermal envelope towards the new operating temperature and an appropriate compensation may be applied to the sensor output.

A sensor system including a chip arrangement, the chip arrangement including a sensor and an acceleration sensor, and the sensor system including a processor circuit. The processor circuit is configured in such a way that: one or multiple temperature-dependent variables and/or properties of the sensor are ascertained, and an offset of a signal of the acceleration sensor induced by a temperature gradient is corrected with the aid of the one or the multiple ascertained temperature-dependent variables and/or properties of the sensor.

To provide a physical quantity sensor in which the influence of deformation of a package substrate on the measuring accuracy of a sensor element can be suppressed. A physical quantity sensor includes a sensor element that detects a predetermined physical quantity and outputs an electrical signal, a plurality of lead portions that are connected to the sensor element, and a package substrate that accommodates the sensor element and the plurality of lead portions. The plurality of lead portions are connected at proximal end sides thereof to the package substrate side, and connected at distal end sides thereof to the sensor element side, and the plurality of lead portions support the sensor element in such a manner that the sensor element does not contact the package substrate and that the transmission of deformation of the package substrate side to the sensor element is suppressed.

A system comprising: an inner housing; an electronic device disposed within the inner housing, the electronic device comprising processing circuitry and generator circuitry; an outer housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC comprising: a first surface thermally coupled to the inner housing, and a second surface thermally coupled to the outer housing, wherein the processing circuitry is coupled to the TEC, and is configured to: receive electrical signals; determine the temperature of the inner housing based on the received electrical signals; compare the determined temperature against a threshold temperature; and based on a determination that the determined temperature does not satisfy the threshold temperature, cause the generator circuitry to deliver DC electric current to the TEC to cause the TEC to modulate the temperature of the inner housing.

An inertial measurement unit (IMU) device includes an IMU sensor, a controller, a temperature sensor electrically connected to the controller, a heat source, and a heat conductive member. The controller is configured to, in response to a temperature of the IMU sensor detected by the temperature sensor falling below a threshold temperature, control the heat source to generate heat. The heat conductive member is configured to transfer heat from the heat source to the IMU sensor, and includes an electrically insulating and thermally conductive material.

An accelerometer includes a housing, a proof mass assembly encased in the housing, and one or more heating elements configured to heat the proof mass assembly in response to an electrical current. The one or more heating elements include a positive temperature coefficient of resistance (PTC) material. The PTC material exhibits a relatively high increase in resistance above a threshold temperature. For example, a ratio of the resistance of the PTC material above the threshold temperature to the resistance of the PTC material at room temperature (PTC ratio) is greater than five.