G01P1/006

Inertial measurement unit and movable device using the same

An inertial measurement unit includes a sensor and a heat preservation system. The heat preservation system includes a heat preservation body and a heat source. The sensor is positioned on the heat preservation body. The heat source is configured to generate heat. The heat preservation body is configured to transfer the heat from the heat source to the sensor to maintain a preset temperature in a space surrounding the sensor.

POSITIONING APPARATUS COMPRISING AN INERTIAL SENSOR AND INERTIAL SENSOR TEMPERATURE COMPENSATION METHOD
20200292570 · 2020-09-17 ·

A positioning apparatus includes: a reference device configured to provide a measured current motion angle of a vehicle; an inertial sensor configured to provide a current input angular rate of the vehicle and associated with at least one inertial sensor behavior parameter dependent on inertial sensor temperature; a temperature sensor configured to provide an input temperature variation of the inertial sensor on a time interval; and a digital estimator configured to recursively computing an estimated current motion angle of the vehicle and at least one previously estimated inertial sensor behavior parameter as function of: the measured current motion angle, a previously estimated motion angle, the current input angular rate, and the input temperature variation.

FIBER-OPTIC ACCELERATION SENSOR HAVING LEVER ARM
20200233008 · 2020-07-23 ·

The invention relates to a device for detecting acceleration. The device contains: a frame; a mass; a lever arm connected to the mass, wherein the mass is provided at a first lever position; an optical fiber having a fiber-optic sensor; and a compensation element for disturbance variables, wherein the compensation element for disturbance variables is connected to the lever arm or the mass and wherein the compensation element for disturbance variables is connected to the frame.

MULTI-COMPONENT FAST-RESPONSE VELOCITY SENSOR

A system and method for measuring multiple velocity components with a single wire, by alternating current through the wire at a sufficiently high frequency, where the first current allows measurement of a first velocity component, and the second current allows measurement of a second velocity component. The resolution of the measurements can be adjusted by altering the frequency at which the current is alternated.

Sensing system and method for improving control of a sensor detection value

A sensing system and method are provided. The sensing system includes a sensor unit that is configured to output a voltage having a magnitude that corresponds to a detected physical quantity and an amplification unit that is configured to amplify a magnitude in the output of the sensor unit to a constant gain. An offset removal unit is configured to remove a direct current (DC) offset from an output amplified by the amplification unit to generate a first detection signal. An inversion circuit unit is configured to invert the first detection signal to generate a second detection signal. A microcomputer is configured to then calculate the physical quantity detected by the sensor unit based on the first detection signal and the second detection signal.

Auxetic interposer for microelectromechanical systems (MEMS) device and MEMS device package including the same

An auxetic interposer includes: a frame enclosing an interior space; a pad arranged within the interior space; and a plurality of micro auxetic lattices extending between the frame and the pad.

DECOUPLING STRUCTURE FOR ACCELEROMETER
20200180945 · 2020-06-11 ·

Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

ACCELEROMETER WITH BUILT-IN TEMPERATURE CORRECTION
20200158748 · 2020-05-21 ·

Systems and methods are disclosed for generating temperature compensated acceleration data in analog and digital format from a torque balance accelerometer (TBA). During manufacture of the TBA, a calibration process is used for measuring a TBA scale factor and offset. After collecting scale and offset data, said data is loaded into the memory of the TBA. Field operation of the device includes: sensing a current temperature, retrieving the closest scale and offset correction factors from memory of the TBA, and performing linear interpolation to generate a temperature-compensated output for the TBA.

Method for temperature compensation of a microelectromechanical sensor, and microelectromechanical sensor

A method for temperature compensation of a MEMS sensor. The method includes: in a balancing step, a temperature gradient is produced by a thermal element and a first and a second temperature are determined at a first and a second temperature measurement point, wherein a deflection of a movable structure produced by the temperature gradient is measured and a compensation value is ascertained dependent on the first and second temperature and the deflection; in a measurement step, a physical stimulus is measured by way of a deflection of the movable structure and a third and fourth temperature is determined at the first and second temperature measurement points; in a compensation step, a measured value of the physical stimulus is ascertained dependent on the measured deflection, the third and fourth temperature and the compensation value. A method is also provided including: a regulation step, and a measurement step.

Fluid test device with electrical connector having electric heating tube for heat exchange process

An electrical connector includes a main body portion, connection portions, a total pressure acquisition portion and a static pressure acquisition portion. The connection portions are configured to allow the main body portion to be electrically connected to a charged element provided in a flow channel. The total pressure acquisition portion includes a total pressure measuring hole provided in a first part, facing a flow direction of fluid, of the main body portion. The static pressure acquisition portion includes a static pressure measuring hole provided in a second part, parallel to the flow direction of the fluid, of the main body portion. The fluid state test device and the fluid heat exchange system having the electrical connector are also provided. Thus, the original flow field where the electrical connector of the electrode of the electric heat source is located may not be changed, which avoids destruction to the flow field.