Patent classifications
G04D3/0069
Watch Component, And Watch
A watch component having an oxide film formed by oxidizing a base material containing iron as a main component, an average film thickness of the oxide film is from 70 nm to 145 nm, and a variation in film thickness of the oxide film is equal to or less than 35%.
Watch Component, Watch, And Manufacturing Method For Watch Component
A watch component includes a base material including a first region having a surface at which a plurality of recessed portions are formed and a second region having a smooth surface, and a multilayer film configured to cover at least a portion of the base material. When viewed in a cross-sectional view taken along a thickness direction of the base material, the plurality of recessed portions are defined by a first side and a second side that is tilted with respect to the first side and is in contact with the first side at an end portion, and a hue angle of the first region is greater than a hue angle of the second region.
Watch Part, Watch, And Method For Manufacturing Watch Part
A watch part includes a substrate and a multilayer film covering at least a part of the substrate, wherein a plurality of recesses are formed at a surface of the substrate facing the multilayer film, and in a cross-sectional view of the substrate taken in a thickness direction thereof, each of the plurality of recesses is defined by a first side and a second side that is inclined with respect to the first side and meets the first side.
BLACK COMPONENT DECORATED WITH STONES AND METHOD FOR MANUFACTURING SAME
A component and method of making the internal parts or movement for a timepiece or piece of jewelry that includes a substrate partially coated with a black layer and decorated with at least one stone, said black layer including carbon nanotubes or aluminum oxide, said substrate being at least devoid of the black layer on the portion facing the stone.
Method for manufacturing a one-piece silicon device with flexible blades, in particular for timepieces
A one-piece silicon device with flexible blades (2, 3), in particular for timepieces, for example a pivot with crossed blades, and to a method for manufacturing the device (1). The method includes: forming (21) a one-piece silicon device (1) blank from a wafer of the SOI type, the device (1) including two flexible blades (2, 3), each formed in a different layer of the SOI wafer, the blades (2, 3) being arranged in two different substantially parallel planes, the blades (2, 3) being separated by a clearance (7); growing a first silicon oxide layer on the surface of at least one of the blades (2, 3) bordering the clearance, the first silicon oxide layer being formed from a first sub-layer of silicon of the one or more blades (2, 3); and removing the first silicon oxide layer to increase the clearance (7) between the two blades (2, 3).
Method for producing a silicon-based timepiece spring
A method for producing a timepiece spring includes the following steps: producing a piece based on silicon, having the desired shape of the timepiece spring; thermally oxidising the piece; deoxidising the piece; annealing the piece in a reducing atmosphere; forming a silicon oxide layer on the piece.
Multistage micromechanical timepiece and method for making same
A micromechanical timepiece, and a method for making the same, having a plurality of mutually secured functional sub-assemblies stacked in a direction (Z) to form a multistage assembly, wherein each functional sub-assembly comprises a single semiconductor material and is secured to another sub-assembly via bridges made of the semiconductor material, and in that at least one sub-assembly comprises at least two portions, the portions being movable relative to each other and relative to another sub-assembly to which at least one of the portions is secured via at least one deformable link integrally formed between the portions.
MULTISTAGE MICROMECHANICAL TIMEPIECE AND METHOD FOR MAKING SAME
A micromechanical timepiece, and a method for making the same, having a plurality of mutually secured functional sub-assemblies stacked in a direction (Z) to form a multistage assembly, wherein each functional sub-assembly comprises a single semiconductor material and is secured to another sub-assembly via bridges made of the semiconductor material, and in that at least one sub-assembly comprises at least two portions, the portions being movable relative to each other and relative to another sub-assembly to which at least one of the portions is secured via at least one deformable link integrally formed between the portions.
Micro-mechanical timepiece part
The micromechanical clockwork part is cut from a plate-like silicon substrate. The cut edges of the part include portions intended to serve as contact surfaces arranged to slide against corresponding contact zones of another micromechanical part in a clockwork piece. The cut edges have a ribbed surface including an alternating set of ribs and furrows, the ribs and the furrows being straight and each contained in a plane parallel to the plate. Moreover, the ribs and furrows which the cut edges have form a stepped pattern on the cut edge, with first intervals in which the spacing separating the ribs from one another is equal to a first distance, and at least one second interval in which the spacing between the ribs is equal to a second distance different from the first distance.
CAM-TYPE TIMEPIECE COMPONENT
A cam-type timepiece component (1), which has at least one portion of substantially planar shape, having a material hardness greater than or equal to 600 hv, this portion having a thickness greater than or equal to 350 microns, or even greater than or equal to 400 microns, and comprising at least one functional flank (3) which is substantially perpendicular to a main surface (2) of this portion and has a roughness ra of less than or equal to 50 nm.