A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

The present disclosure relates to a radar-based fill-level measurement device for measuring a fill level of a fill substance located in a container. Besides a housing, the device includes an antenna and a housing neck, which is arranged between the housing and the antenna, wherein the housing neck has between the housing and the antenna a predefined thermal resistance, and at least one electronics module partially arranged in the housing neck. The thermal resistance of the housing neck is dimensioned in such a manner to be low, such that, at a temperature in the container of at least 200° C., the temperature at the electronics module is limited to, at most, 80° C. Thus, a high resolution and temperature-resistant and simultaneously compact, fill-level measurement device is provided for high radar frequencies of, for example, 79 GHz.

A radar device configured to emit radio waves and detects an object present in a prescribed detection region includes an antenna unit and a radio wave reflector. The antenna unit is configured to emit the radio waves. The radio wave reflector is disposed in a region around the antenna unit and outside the detection region and includes a reflection surface having a height gradually changed with respect to an installation surface of the radar device.

A transportation apparatus includes an external detection device configured to detect an object. The external detection device is disposed further on an inner side than an outer surface of the transportation apparatus, on the outer surface, a lid member is attached to be removable and cover an irradiation surface when viewed from a perpendicular direction perpendicular to the irradiation surface of the external detection device, the lid member is formed so as to be removable from an abutment portion provided on the outer surface by being pressed from an inside, the outer surface is provided with an opening portion disposed close to the abutment portion, and the lid member is disposed so as to be pressable from the inside through the opening portion.

A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.

A sensor module includes a sensor module main body having a rectangular board provided with a radio radar sensor function, and a metallic case having a rectangular parallelepiped box shape in which an opening part opened at one face in a thickness direction is formed and a cut-out opening for drawing out a cable connecting the sensor module main body is formed on a side face, the opening part being closed by the board inserted through the opening part with a component disposed on a front face of the board facing toward a bottom part on the inner side, and the cable is inserted into at least a part of the cut-out opening, and the cut-out opening is formed to be symmetrical with respect to a plane passing through the center of the metallic case and perpendicular to a plane of the cut-out opening.

An electromagnetic illuminator heater is provided having a heat generating wire and an elongate encasement of thermally transmissive, temperature mitigating, and electrically insulative material. The material encompasses the elongate heating wire. A heater for devices is also provided.

A vehicle sensor mounting structure includes a first sensor kit and a second sensor kit, each having a sensor group including a plurality of sensors and a bracket on an upper surface of which the sensor group is installed, a first fitting portion which is provided on a front side of the roof in a vehicle front-rear direction and into which a first bracket is fitted such that the upper surface is exposed, and a second fitting portion which is provided on a rear side of the roof in the vehicle front-rear direction so as to face the first fitting portion in the vehicle front-rear direction and into which a second bracket is fitted such that the upper surface is exposed. The plurality of sensors of each sensor group includes at least two kinds of sensors selected from among a camera, a millimeter wave radar, and a LiDAR sensor.

Provided is a lamp device including: a housing, which is a part to be attached to a vehicle; a lamp unit; a radar unit having an antenna which transmits a radar wave and receives a reflection wave from an object; a light-transmissive cover which is attached to cover a front surface of the housing so as to accommodate therein the lamp unit and the radar unit, and through which the radar wave passes; and a radio wave absorption section provided on a surface of the housing that faces the light-transmissive cover or on a surface on the opposite side therefrom.

A radar device is provided. The radar device includes an antenna and a housing having an exterior wall. The radar device also includes an electronics module having a heat source contained within the housing. Additionally, the radar device includes a heat pipe having a first end and a second end. The first end is positioned proximate to the heat source, and the heat pipe is configured to transfer heat from the first end of the heat pipe to the second end of the heat pipe to reduce an amount of heat at the heat source. The heat pipe may be an evaporator-condenser heat pipe. The second end of the heat pipe may be positioned proximate to a first dissipating feature. The heat source may be a power amplifier, waveguide assembly, printed circuit board, or other electronics, and the first dissipating feature may be the exterior wall of the housing.