A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring. A method includes disposing a first plunger within a spring along a spring longitudinal axis, disposing a second probe within the spring along the spring longitudinal axis, and engaging the spring latch and the second plunger spring latch with the spring, for instance by capturing an end coil of the spring with the spring latch of at least one of the spring latch or the second plunger spring latch.

A USB integrated circuit (IC), a testing platform and an operating method for USB integrated circuit are provided. The USB integrated circuit includes a USB port physical layer (PHY) circuit, a first lane adapter, a second lane adapter, a routing circuit, and a USB transport layer circuit. The USB PHY circuit is configured to transmit a differential signal between the USB integrated circuit and an outside device. When the USB integrated circuit operates in a testing mode, the routing circuit electrically connects the first lane adapter to the USB PHY circuit. When the USB integrated circuit operates in a working mode, the routing circuit electrically connects the second lane adapter to the USB PHY circuit. The USB transport layer circuit is coupled to the first lane adapter and the second lane adapter.

A device to measure the voltage at a test point, also referred to as a test point voltage sensor, comprises a housing formed from a first material and a second material, wherein the first material comprises an insulating material and the second material comprises a conductive or semiconductive material. The housing includes an opening configured to cover a test point of a cable accessory. The device further includes a pressure pad, disposed in the housing, having a conductive mating surface configured to contact a test point of the basic insulation plug or end plug. The device further includes a low side capacitor embedded in the housing and electrically coupled to the conductive mating surface. The device further includes a signal wire electrically coupled to the low side capacitor.

A method (200) and a connection test device (100; 300) for checking an intermittent impedance variation in a first and/or a second line (110; 302, 334) are described. The connection test device (100; 300) comprises a transmitter (102; 308) having a test signal generator (106) for generating a test signal and a first test point (108; 304) for connecting the first (110; 302) or the second line (334), wherein the test signal generator (106) supplies the test signal to the first (110; 302) or the second line (334) via the first test point (108; 304). The connection test device (100; 300) further comprises a first receiver (104; 310) having a second test point (112; 306, 336) for connecting the first (110; 302) or second line (334) and a receiver front end (114; 326, 328) which receives an incoming signal from the first (110; 302) or second line (334) via the second test point (112; 306, 336). The connection test device (100; 300) has, in addition, an evaluation logic (116), which is connected to the receiver front end (114; 326, 328) and which compares the input signal to a threshold value in order to identify an intermittent impedance variation in the first (110; 302) and/or the second line (334).

Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position.

The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.

A test device for testing electric properties of an object. The test device includes an object support unit configured to support an object; a cover unit configured to include a cover body coupled to the object support unit and a pusher supported by the cover body so as to move toward and away from the object; and a pressure adjuster configured to include a multi-stage adjusting cam which is rotatably provided in the cover body while contacting the pusher and has a multi-stage contact pressing portion with contact radii varied depending on rotated angles so that the pusher can be in a moving-back position and be positioned at a plurality of pressing distances from the cover body, and an operation unit which operates the multi-stage adjusting cam.

A method for insulating an RC voltage divider includes installing at least one part of an active part of the voltage divider within an inner housing and insulating the at least one part of the active part with an insulating oil within the inner housing, hermetically sealing the inner housing, enclosing the inner housing in an outer housing and filling a space between the inner housing and the outer housing with an insulating gas. A system for insulating an RC voltage divider is also provided.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.