A method for improving the measurement accuracy of scintillation based radiation detectors for ionizing radiation pulses when the multi-channel analyzer of the radiation detector is exposed to continuously varying temperatures.

Embodiments of the invention are utilized to improve the timing performance of SiPM based PET detectors with light-sharing configuration. The universal readout design utilizes adaptive group readout to process noisy and slow signals generated by SiPM devices, and provides enhanced timing capabilities with simplified readout electronics.

An X-ray device including a sensing panel and a scintillator layer is provided. The sensing panel includes a substrate and a first pixel. The first pixel is disposed on the substrate and includes a first light sensing component and a first switch component. The first switch component is disposed on the first light sensing component. The scintillator layer is disposed on the sensing panel, and the first switch component is disposed between the scintillator layer and the first light sensing component.

A borehole muon detector for detecting and characterizing a geographic region of interest is provided, the borehole muon detector comprising a housing and sensor, which is housed in the housing, the sensor including: a plurality of photodetector elements; at least one printed circuit board in electrical communication with the plurality of photodetectors and including an integrated electronic circuit for tracking time; a first helical bundle of scintillator fibers; an oppositely wound helical bundle of scintillator fibers, the oppositely wound helical bundle, the first helical bundle and the opposite helical bundle defining an outer cylinder, which includes a first end and a second end and a bore therebetween, each scintillator fiber of each bundle directly optically connected to a photodetector element at least at one end and indirectly optically connected to the photodetector element at no more than one end; and a plurality of scintillator bars, each comprising a first end, a second end and an optical fiber extending from the first end to the second end, the plurality of scintillator bars vertically disposed in the bore of the outer cylinder, each optical fiber of the scintillator bar optically directly connected to a photodetector element at least at one end and indirectly optically connected to the photodetector at no more than one end.

The present disclosure provides an active pixel sensor and a flat panel detector. The active pixel sensor includes: a light sensing device configured to convert light sensed by the light sensing device into charges and supply the charges to a floating diffusion node; an amplification sub-circuit configured to amplify a signal according to a potential at the floating diffusion node and output the amplified signal through the output terminal; an adjustment sub-circuit configured to adjust, in response to a first control signal, a conversion gain from an amount of the light sensed by the light sensing device to the potential at the floating diffusion node; and a read sub-circuit configured to transmit a voltage of the input terminal of the read sub-circuit to the output terminal of the read sub-circuit according to a scan signal provided by the scan line.

A method and a system for a two-step calibration method for the polychromatic semiconductor-based PCD forward counting model, to account for various pixel summing readout modes for imaging at different resolutions. The flux independent weighted bin response function is estimated using the expectation maximization method, and then used to estimate the pileup correction terms at plural tube voltage settings for each detector pixel. To correct the variation of the detector response due to different PCD sub-pixel summing schemes, the embodiments calibrate forward model parameters based on the various pixel readout modes.

Provided is a radiographic imaging device including: a first hardware processor; a sensor that includes multiple semiconductor elements arranged two-dimensionally and multiple switch elements respectively connected to the semiconductor elements; a gate driver that causes each of the switch elements of the sensor to switch between a conductive state and non-conductive state so as to release charge from each of the semiconductor elements; and a reader that performs readout of a signal value according to an amount of the charge released by the each of the semiconductor elements of the sensor. The first hardware processor sets an imaging condition that affects a dose of radiation reaching the sensor, selects a gate readout pattern according to the set imaging condition among different gate readout patterns, and drives the gate driver and the reader using the selected gate readout pattern.

An array substrate for a digital X-ray detector, a digital X-ray detector including the same, and a method for manufacturing the same are disclosed. The array substrate reduces a step difference of a PIN diode, removes a bent part from a lower part to reduce characteristic deterioration of the PIN diode, and increases the size of a formation region of the PIN diode to increase a fill factor. To this end, the array substrate allows a source region of an active layer included in a thin film transistor to be in surface contact with a lower electrode of the PIN diode, and disposes the lower electrode over a planarized source region or a base substrate, such that a step difference of the PIN diode is reduced and fill factor is improved.

Provided is a radiography apparatus capable of changing the shape and size at an imaging site. A radiography apparatus (1) includes a scintillator (12), and a substrate (11) that is laminated on the scintillator (12) and has a plurality of photoelectric conversion elements (17) converting light emitted from the scintillator (12) into electric charges, in which a laminate including the scintillator (12) and the substrate (11) is partitioned into a plurality of blocks (10A) to (10I), and the blocks are separable from each other.

Disclosed herein is an image sensor comprising: a plurality of packages arranged in a plurality of layers; wherein each of the packages comprises an X-ray detector mounted on a printed circuit board (PCB); wherein the packages are mounted on one or more system PCBs; wherein within an area encompassing a plurality of the X-ray detectors in the plurality of packages, a dead zone of the packages in each of the plurality of layers is shadowed by the packages in the other layers.