A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.

An optical device includes: a light guide plate receiving, for each of N types of wavelength bands, a plurality of parallel light beams with different incident angles each corresponding to view angles, and guiding the received parallel light beams; a first and a second volume hologram gratings of reflection type having a diffraction configuration which includes N types of interference fringes each corresponding to the N types of wavelength bands, and diffracting/reflecting the parallel light beams. The optical device satisfies for each wavelength band, a relationship of ‘P>L’, where ‘L’ represents a central diffraction wavelength in the first and second volume hologram gratings, defined for a parallel light beam corresponding to a central view angle, and ‘P’ represents a peak wavelength of the parallel light beams.

An optical device includes: a light guide plate receiving, for each of N types of wavelength bands, a plurality of parallel light beams with different incident angles each corresponding to view angles, and guiding the received parallel light beams; a first and a second volume hologram gratings of reflection type having a diffraction configuration which includes N types of interference fringes each corresponding to the N types of wavelength bands, and diffracting/reflecting the parallel light beams. The optical device satisfies for each wavelength band, a relationship of ‘P>L’, where ‘L’ represents a central diffraction wavelength in the first and second volume hologram gratings, defined for a parallel light beam corresponding to a central view angle, and ‘P’ represents a peak wavelength of the parallel light beams.

Devices and systems to perform optical alignment by using one or more liquid crystal layers to actively steer a light beam from an optical fiber to an optical waveguide integrated on a chip. An on-chip feedback mechanism can steer the beam between the fiber and a grating based waveguide to minimize the insertion loss of the system.

Embodiments described herein relate to a large area lens-free imaging device. One example is a lens-free device for imaging one or more objects. The lens-free device includes a light source positioned for illuminating at least one object. The lens-free device also includes a detector positioned for recording interference patterns of the illuminated at least one object. The light source includes a plurality of light emitters that are positioned and configured to create a controlled light wavefront for performing lens-free imaging.

A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.

A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.

An easy-to-fabricate and highly efficient single-mode optical fiber-to-single-mode optical waveguide coupler having relatively large horizontal and vertical alignment tolerances between the fiber and the waveguide coupler. The waveguide coupler also features ease of end-facet cleaving. The waveguide coupler can be used in ultra-broadband high coupling efficiency applications or other suitable applications. Single-mode on-chip waveguides incorporating such coupler(s) are also provided, as are methods of manufacturing the waveguide coupler and on-chip waveguide.

A self-lit display panel includes a photonic integrated circuit payer including an array of waveguides and an array of out-couplers for out-coupling portions of the illuminating light through pixels of the panel. The self-lit display panel may include a transparent electronic circuitry layer backlit by the photonic integrated circuit layer; the two layers may be on a same substrate or on opposed substrates defining a cell filled with an electro-active material. The configuration allows for chief ray engineering, zonal illuminating, and separate illumination with red, green, and blue illuminating light.

A photonic integrated circuit device can comprise one or more layers having different refraction indices that cause optical coupling issues and losses from layer variations. A film of material can be applied to a layer of the photonic integrated circuit to avoid the issues to increase the optical bandwidth of the photonic integrated circuit device and decrease sensitivity to manufacturing and design processes.