Provided is a connector plug includes: an optical device module having an optical engine that generates an optical signal or receives an optical signal; an optical fiber alignment guide member having an optical fiber insertion channel formed on one surface of the optical device module so that optical fibers are seated; and an optical component that is seated in an optical component alignment guide groove formed adjacent to the optical fiber alignment guide member on one surface of the optical device module, wherein the optical engine includes an optical device which is formed adjacent to the optical component on one surface of the optical device module, and which radiates an optical signal or receives an optical signal in the horizontal direction, and an optical integrated circuit (IC) installed in the optical device module and controlling the optical device.

A method of manufacturing an optical engine includes bonding a plurality of laser diodes directly or indirectly to a base substrate and coupling at least one laser diode driver circuit to the laser diodes. In operation the at least one laser diode driver circuit selectively drives current to the laser diodes. The method further includes bonding a plurality of collimation lenses to the base substrate proximate the plurality of laser diodes and bonding a cap including at least one wall and at least one optical window to the base substrate. The method also includes bonding a grating waveguide combiner proximate the optical window of the cap. In operation, the grating waveguide combiner receives a plurality of beams of light at a respective plurality of input grating couplers and combines the plurality of beams of light to provide a collimated aggregated beam of light at an output grating coupler.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

An optical sensor system comprising: (a) a light source for at least one optical sensor, the light source comprising at least, (i) an interposer having first and second opposing sides and defining at least one alignment aperture extending from the first opposing side to the second opposing side; (ii) at least one fiber disposed in the at least one alignment aperture, the at least one fiber having a first optical axis; (iii) at least one light emitting component mounted to the second opposing side and having a second optical axis coincident with the first optical axis, the light emitting component configured to emit light, at least a portion of which is coupled with the at least one fiber as coupled light; and (b) the at least one optical sensor optically coupled to the at least one fiber.

Photonic integrated circuits (PICs) enable manipulation of light on a chip for telecommunications and information processing. They can be made with silicon and silicon-compatible materials using complementary metal-oxide-semiconductor (CMOS) fabrication techniques developed for making electronics. Unfortunately, most light sources are made with III-V and II-VI materials, which are not compatible with silicon CMOS fabrication techniques. As a result, the light source for a PIC is either off-chip or integrated onto the PIC after CMOS fabrication is over. Hybrid integration can be improved by forming a recess in the PIC to receive a III-V or II-VI photonic chip. Mechanical stops formed in or next to the recess during fabrication align the photonic chip vertically to the PIC. Fiducials on the PIC and the photonic chip enable sub-micron lateral alignment. As a result, the photonic chip can be flip-chip bonded to the PIC with sub-micron vertical and lateral alignment precision.

A packaging and assembly of a parallel optical link is disclosed. The packaging and assembly may have four major parts: assembly of the optical transceiver die, 2.5D package assembly, package attachment to a system printed circuit board, and optical coupling attachment. A frame and a removable lid may be attached to the optical transceiver die. The lid may protect the optical transceiver array of the optical transceiver die, and the frame may help in aligning optical coupling assembly with the optical transceiver array.

An optical fiber mounting mechanism includes an optical fiber, a signal circuit, and a mounting structure. The optical fiber extends along a first direction. The signal circuit extends along the first direction. The mounting structure is disposed at ends of the optical fiber and the signal circuit. The mounting structure surrounds the optical fiber and the signal circuit. The mounting structure has an installation portion. The installation portion extends radially relative to the first direction as the axis direction. The installation portion has a plurality of elements. The elements are exposed from a surface of the installation portion. The surface has a normal direction parallel with the first direction.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.