The present invention relates to a substrate structure for LED lighting, the structure being capable of improving the hemispherical intensity distribution of a lighting device in which an LED is used, thereby improving the light efficiency of the lighting device. The substrate structure includes a first substrate for mounting a first LED thereon and three second substrates, each for mounting a second LED thereon. The second substrates are coupled to the first substrate such that the second substrates are perpendicular to the first substrate and are arranged at an angular interval which is within a range of 115 to 125 with respect to each other in a cross-sectional view taken parallel to the first substrate. One or more second substrates of the three second substrates are provided with one or more control circuits for controlling operation of either of or both of the first LED and the second LED, in which the control circuit is disposed in an end portion of the second substrate in a direction perpendicular to the first substrate.

Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.

Embodiments include an interconnectable circuit board array. The interconnectable circuit board array includes a plurality of interconnectable circuit boards coupled together with a plurality of board to board connectors. The board to board connectors include a first lateral side conductor and a second lateral side conductor to provide electrical communication between the connect circuit boards. The board to board connectors are configured such that when two adjacent circuit boards are bent in a lateral plane with respect to one another to form an angle, one of the lateral side conductors is contracted, one of the lateral side conductors is expanded, or one of the lateral side conductors is contracted and the other lateral side conductor is expanded. Other embodiments are also included herein.

A pluggable module comprising a housing having a first end and second end, an edge connector disposed at the first end, an F-type coaxial connector at the second end and a release lever including a stamped body that is symmetrical about a centerline bisecting the length of the body. The pluggable module comprises a miniature balun disposed within the module for converting between a single-ended input to a differential load.

Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.

The present invention relates to a substrate structure for LED lighting, the structure being capable of improving the hemispherical intensity distribution of a lighting device in which an LED is used, thereby improving the light efficiency of the lighting device. The substrate structure includes a first substrate for mounting a first LED thereon and three second substrates, each for mounting a second LED thereon. The second substrates are coupled to the first substrate such that the second substrates are perpendicular to the first substrate and are arranged at an angular interval which is within a range of 115 to 125 with respect to each other in a cross-sectional view taken parallel to the first substrate. One or more second substrates of the three second substrates are provided with one or more control circuits for controlling operation of either of or both of the first LED and the second LED, in which the control circuit is disposed in an end portion of the second substrate in a direction perpendicular to the first substrate.

A flexible printed circuit board installed on a substrate in a display device is provided.

A rollable display device includes a rollable structure including a plurality of unit structures, the rollable structure being configured to be rolled and unrolled based on the unit structures, and a display panel structure attached to the rollable structure, wherein respective widths of the unit structures increase in a first direction from a first side of the rollable structure to an opposite second side of the rollable structure.

A rollable display device includes a rollable structure including a plurality of unit structures, the rollable structure being configured to be rolled and unrolled based on the unit structures, and a display panel structure attached to the rollable structure, wherein respective widths of the unit structures increase in a first direction from a first side of the rollable structure to an opposite second side of the rollable structure.

The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) is adapted to be coupled to a bond wire (460a, 460b) independently from the other electrically conductive layer (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.