Flexible printed circuit (FPC) connector includes a flex circuit having first and second side surfaces and a thickness extending between the first and second side surfaces. The flex circuit includes a plurality of stacked substrate layers. The FPC connector also includes a conductive pathway extending through the flex circuit and a substrate protrusion coupled to the second side surface and projecting a distance away from the second side surface. The substrate protrusion is formed from at least one dielectric layer. The FPC connector also includes a contact pad that is directly coupled to at least one of the substrate protrusion or the second side surface of the flex circuit. The contact pad is electrically coupled to the conductive pathway.

A flexible printed circuit board installed on a substrate in a display device is provided.

A transceiver assembly is provided that includes a transceiver housing having first end, having a connector and an opposite second end having a passage in communication with a printed circuit board mounted in the housing. A peripheral connector having a first end and opposite second end includes a receptacle opening at the second end. A flex circuit is disposed between the first end of the peripheral connector and the second end of the transceiver housing. The peripheral connector is capable of being displaced with respect to the transceiver housing via the flex circuit.

An optoelectronic assembly (10) is provided in different embodiments. The optoelectronic assembly (10) has the following; a printed circuit board (12); at least one optoelectronic first component (20) which is arranged on a first face (14) of the printed circuit board (12); a heat sink (24) which has a first surface (26) that is arranged on a second printed circuit board (12) face (16) facing away from the first component (20), wherein a boundary surface (34) extends between the second face (16) and the first surface (26); and at least one first welding connection (30), by means of which the heat sink (24) is directly connected to the printed circuit board (12) in a bonded manner and which together with the boundary surface (34) forms a first cut surface (36), the first component (20) at least partly overlapping the cut surface.

A photovoltaic module includes: a flexible printed circuit; and a plurality of power generating elements mounted on the flexible printed circuit, wherein the flexible printed circuit includes a turning portion, and strip-shaped portions of the flexible printed circuit which are located on opposite sides of the turning portion are aligned so as to oppose each other.

This power generation module includes: a power generating portion (30) including a power generating element (19); and a wiring substrate. The wiring substrate includes: a reinforcement plate; and a flexible printed circuit (79) provided above the reinforcement plate. The flexible printed circuit (79) has: an FPC land portion (70) configured to have the power generating portion (30) mounted thereto; and a FPC wire portion (73) connected to the FPC land portion (70). The width of the FPC wire portion (73) is smaller than the width of the FPC land portion (70).

The present disclosure relates to an optoelectrical connector module comprising a flexible circuit board (10) having a first region and a second region and a printed circuit board (PCB) (20) that is attached to the first region of the flexible circuit board, and an optical module (30) that is attached to the second region of the flexible circuit board. The optical module is configured to transmit and/or receive light signals. The optoelectrical connector module comprises further a rigid support structure (40) having a first and a second surface that enclose a defined angle. The first surface of the rigid support structure is thereby arranged in parallel to the PCB and the second surface of the rigid support structure is connected to the flexible circuit board opposite the second region.

This power generation circuit unit includes a wiring substrate and a plurality of power generating elements mounted to the wiring substrate. The wiring substrate includes: a first substrate (32E) and a second substrate (32F) to each of which the power generating element is mounted; and a coupling portion (33L) configured to couple the first substrate (32E) and the second substrate (32F) together. The first substrate (32E) can be disposed at at least two positions of: a first position separated from the second substrate (32F) by a first distance; and a second position separated from the second substrate (32F) by a second distance being greater than the first distance. The coupling portion (33L) has an FPC (flexible printed circuits). In a state where the first substrate is disposed at the second position, at least a part of the coupling portion (33L) is twisted.

This wiring module includes: a wiring substrate; a base portion at which the wiring substrate is placed; and an adhesive layer configured to adhere the wiring substrate to the base portion, wherein the wiring substrate includes: a land portion configured to have a power generating element mounted thereto; and a wire portion configured to be electrically connected to the power generating element, the adhesive layer has: a land adhesion region configured to adhere the land portion to the base portion; and a wire adhesion region configured to adhere the wire portion to the base portion, and a width of the wire adhesion region is smaller than a width of the land adhesion region.

A wiring substrate is configured to have a power generating portion mounted thereto. The wiring substrate includes a land portion and a wire portion. The width of the wire portion is smaller than the width of the land portion.