Power amplifier electronics for controlling application of radio frequency (RF) energy generated using solid state electronic components may further be configured to control application of RF energy in cycles between high and low powers. The power amplifier electronics may include a semiconductor die on which one or more RF power transistors are fabricated, an output matching network configured to provide impedance matching between the semiconductor die and external components operably coupled to an output tab, and bonding ribbon bonded at terminal ends thereof to operably couple the one or more RF power transistors of the semiconductor die to the output matching network. The bonding ribbon may have a width of greater than about five times a thickness of the bonding ribbon.

Describe is a buffer which comprises: a differential source follower coupled to a first input and a second input; first and second current steering devices coupled to the differential source follower; and a current source coupled to the first and second current steering devices. The buffer provides high supply noise rejection ratio (PSRR) together with high bandwidth.

Describe is a buffer which comprises: a differential source follower coupled to a first input and a second input; first and second current steering devices coupled to the differential source follower; and a current source coupled to the first and second current steering devices. The buffer provides high supply noise rejection ratio (PSRR) together with high bandwidth.

Systems and methods for improving output stability of an RFPA. The systems may obtain an initial radio frequency signal to be amplified by the RFPA. The systems may also generate a compensated radio frequency signal by performing, based on a preset compensation rule and a set of compensation parameters, a gain compensation operation for the initial radio frequency signal. The set of compensation parameters may include a supply voltage of the RFPA and a transistor junction temperature of the RFPA. The systems may further generate, by performing a non-linear correction operation on the compensated radio frequency signal, a corrected radio frequency signal, which is transmitted to the RFPA.

A power amplifier circuit includes a power splitter, a first amplifier, a second amplifier, a third amplifier, a fourth amplifier, a first bias circuit, a first line connecting the first bias circuit and the first amplifier, and a second line connecting the first bias circuit and the third amplifier on the same semiconductor substrate, in which the first line and the second line are formed such that a voltage drop amount of the first bias voltage between the first bias circuit and the first amplifier is substantially equal to a voltage drop amount of the first bias voltage between the first bias circuit and the third amplifier.

A power amplifier circuit includes a power splitter, a first amplifier, a second amplifier, a third amplifier, a fourth amplifier, a first bias circuit, a first line connecting the first bias circuit and the first amplifier, and a second line connecting the first bias circuit and the third amplifier on the same semiconductor substrate, in which the first line and the second line are formed such that a voltage drop amount of the first bias voltage between the first bias circuit and the first amplifier is substantially equal to a voltage drop amount of the first bias voltage between the first bias circuit and the third amplifier.

An RF amplifier includes an amplifier input, a transistor die with a transistor and a transistor input terminal, a fundamental frequency impedance matching circuit coupled between the amplifier input and the transistor input terminal, and a harmonic frequency termination circuit coupled between the transistor input terminal and a ground reference node. The harmonic frequency termination circuit includes a first inductance coupled between the transistor input terminal and a first node, and a tank circuit coupled between the first node and the ground reference node. The tank circuit includes a first capacitance coupled between the first node and the ground reference node, and a second inductance coupled between the first node and the ground reference node. The tank circuit is configured to shunt signal energy at or near a second harmonic frequency, while appearing as an open circuit to signal energy at a fundamental frequency of operation of the RF amplifier.

According to at least one example of the disclosure, a power amplifier system is provided comprising an amplifying transistor configured to amplify a radio frequency signal, a bias circuit configured to provide a bias voltage to the amplifying transistor, and a clamp circuit for protecting the power amplifier system by absorbing a current flowing through the amplifying transistor when the clamp circuit is switched on. The clamp circuit is connected at a bias node between the bias circuit and the amplifying transistor and includes a clamp transistor and a clamp diode, the clamp diode having one end connected to a collector of the clamp transistor at the bias node and another end connected to a base of the clamp transistor.

According to at least one example of the disclosure, a power amplifier system is provided comprising an amplifying transistor configured to amplify a radio frequency signal, a bias circuit configured to provide a bias voltage to the amplifying transistor, and a clamp circuit for protecting the power amplifier system by absorbing a current flowing through the amplifying transistor when the clamp circuit is switched on. The clamp circuit is connected at a bias node between the bias circuit and the amplifying transistor and includes a clamp transistor and a clamp diode, the clamp diode having one end connected to a collector of the clamp transistor at the bias node and another end connected to a base of the clamp transistor.

An amplifier includes a semiconductor die and a substrate that is distinct from the semiconductor die. The semiconductor die includes a III-V semiconductor substrate, a first RF signal input terminal, a first RF signal output terminal, and a transistor (e.g., a GaN FET). The transistor has a control terminal electrically coupled to the first RF signal input terminal, and a current-carrying terminal electrically coupled to the first RF signal output terminal. The substrate includes a second RF signal input terminal, a second RF signal output terminal, circuitry coupled between the second RF signal input terminal and the second RF signal output terminal, and an electrostatic discharge (ESD) protection circuit. The amplifier also includes a connection electrically coupled between the ESD protection circuit and the control terminal of the transistor. The substrate may be another semiconductor die (e.g., with a driver transistor and/or impedance matching circuitry) or an integrated passive device.