An acoustic wave device includes a support substrate, a piezoelectric layer, and first and second electrodes. The piezoelectric layer overlaps the support substrate in a first direction. The first and second electrodes extend over at least a first major surface of the piezoelectric layer. The first and second electrodes face each other and are at different potentials. A space between a second major surface of the piezoelectric layer and the support substrate is covered by the piezoelectric layer. The first and second electrodes each include an overlap portion overlapping the space in the first direction and a non-overlap portion not overlapping the space in the first direction. At least part of the support substrate includes an attenuation layer and overlaps a region between the non-overlap portions of the first and second electrodes in plan view. The attenuation layer and the support substrate have different crystallinities.

An acoustic wave device includes a support substrate, a piezoelectric layer, and first and second electrodes. The piezoelectric layer overlaps the support substrate in a first direction. The first and second electrodes extend over at least a first major surface of the piezoelectric layer. The first and second electrodes face each other and are at different potentials. A space between a second major surface of the piezoelectric layer and the support substrate is covered by the piezoelectric layer. The first and second electrodes each include an overlap portion overlapping the space in the first direction and a non-overlap portion not overlapping the space in the first direction. At least part of the support substrate includes an attenuation layer and overlaps a region between the non-overlap portions of the first and second electrodes in plan view. The attenuation layer and the support substrate have different crystallinities.

The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator with tunable electromechanical coupling. The disclosed BAW resonator includes a bottom electrode, a top electrode, and a multilayer transduction structure sandwiched therebetween. Herein, the multilayer transduction structure is composed of multiple transduction layers, and at least one of the transduction layers is formed of a ferroelectric material, whose polarization will vary with an electric field across the ferroelectric material. Upon adjusting direct current (DC) bias voltage across the bottom electrode and the top electrode, an overall polarization of the multilayer transduction structure and an overall electromechanical coupling coefficient of the multilayer transduction structure are capable of being changed. Once the change of the overall electromechanical coupling coefficient of the multilayer transduction structure is completed, the overall electromechanical coupling coefficient of the multilayer transduction structure will remain unchanged after removing the DC bias voltage.

The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator, which includes a bottom electrode, a top electrode structure, and a ferroelectric layer sandwiched in between. Herein, the ferroelectric layer is formed of a ferroelectric material, which has a box-shape polarization-electric field (P-E) curve. The ferroelectric layer includes a ferroelectric border (BO) portion positioned at a periphery of the ferroelectric layer and a ferroelectric central portion surrounded by the ferroelectric BO portion. The ferroelectric BO portion has a first polarization and a first electromechanical coupling coefficient, and the ferroelectric central portion has a second polarization and a second electromechanical coupling coefficient. An absolute value of the first polarization is less than an absolute value of the second polarization, and the first electromechanical coupling coefficient is less than the second electromechanical coupling coefficient. The ferroelectric central portion is configured to provide a resonance of the BAW resonator.

The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator, which includes a bottom electrode, a top electrode structure, and a multilayer transduction structure sandwiched therebetween. Herein, the multilayer transduction structure is composed of multiple transduction layers, at least one of which is formed of a ferroelectric material with a box-shape polarization-electric field curve. Each transduction layer includes a transduction border (BO) portion positioned at a periphery of a corresponding transduction layer and a transduction central portion surrounded by the transduction BO portion. A combination of all transduction BO portions forms a transduction BO section of the multilayer transduction structure, and a combination of all transduction central portions forms a transduction central section of the multilayer transduction structure. An electromechanical coupling coefficient of the transduction BO section is less than an electromechanical coupling coefficient of the transduction central section.

An acoustic wave device is provided comprising a substrate and at least one resonator structure of a first type and at least one resonator structure of a second type mounted on the substrate. The resonator structures of the first type are configured to operate as capacitors and have a first thickness, causing the resonator structures to have a first passband frequency range. The resonator structures of the second type have a second thickness that is different from the first thickness, causing the resonator structures to have a second passband frequency range. A method for forming such an acoustic wave device is also provided. A die comprising such an acoustic wave device, a filter comprising such an acoustic wave device, a radio-frequency module comprising such an acoustic wave device, and a wireless mobile device comprising such an acoustic wave device are also provided.

An acoustic wave device is provided comprising a substrate and at least one resonator structure of a first type and at least one resonator structure of a second type mounted on the substrate. The resonator structures of the first type are configured to operate as capacitors and have a first thickness, causing the resonator structures to have a first passband frequency range. The resonator structures of the second type have a second thickness that is different from the first thickness, causing the resonator structures to have a second passband frequency range. A method for forming such an acoustic wave device is also provided. A die comprising such an acoustic wave device, a filter comprising such an acoustic wave device, a radio-frequency module comprising such an acoustic wave device, and a wireless mobile device comprising such an acoustic wave device are also provided.

Techniques regarding forming flip chip interconnects are provided. For example, one or more embodiments described herein can comprise a three-dimensionally printed flip chip interconnect that includes an electrically conductive ink material that is compatible with a three-dimensional printing technology. The three-dimensionally printed flip chip interconnect can be located on a metal surface of a semiconductor chip.

A vibrating arm of a vibrator element has a first surface, a second surface at an opposite side to the first surface in a Z direction, a first side surface and a second side surface as side surfaces, and a third side surface as a tip surface. At least one of the first side surface, the second side surface, and the third side surface includes a first side surface part tilted with respect to a Z direction, and a second side surface part tilted toward the first surface or the second surface with respect to the first side surface part. The first weight is arranged so that an outer edge of the first weight is located at inner side of innermost parts in the first side surface part and the second side surface part, or at the same position as the innermost parts when viewed from the Z direction.

A vibrating arm of a vibrator element has a first surface, a second surface at an opposite side to the first surface in a Z direction, a first side surface and a second side surface as side surfaces, and a third side surface as a tip surface. At least one of the first side surface, the second side surface, and the third side surface includes a first side surface part tilted with respect to a Z direction, and a second side surface part tilted toward the first surface or the second surface with respect to the first side surface part. The first weight is arranged so that an outer edge of the first weight is located at inner side of innermost parts in the first side surface part and the second side surface part, or at the same position as the innermost parts when viewed from the Z direction.