H05K2203/0121

PRINTING DEVICE AND PRINTING METHOD FOR APPLYING A VISCOUS OR PASTY MATERIAL
20190320536 · 2019-10-17 ·

The invention relates to a printing device for applying a viscous or pasty material onto a support substrate and molding a defined material geometry by means of a template. The template which is provided for application and molding purposes has at least one continuous opening, and the opening side facing the support substrate functions as an application opening surface. Furthermore, the opening, in particular the inner wall thereof, forms an outer border for the material geometry outer surface to be molded. As a whole, the template is designed such that an adhesive force of the viscous or pasty material acting on the inner wall of the opening is overcome by means of a relative movement, in particular a movement relative to the support substrate. The template is advantageously formed as a stack composite of at least two sub-templates adjoining each other in a connection region. Each of the sub-templates has at least one sub-opening, by means of which the inner wall of the opening is divided into proportional molding surfaces of the sub-template. Furthermore, sub-opening connection surfaces which correspond to one another are formed in the connection region, and each of the sub-templates can be reversibly separated in the connection region.

REAL-TIME DETECTION AND CORRECTION OF PRINTED CIRCUITRY

A method is provided for detecting faults in a conductive circuitry. The method includes: printing the conductive circuitry on top of a substrate using a printing head; heating the conductive circuitry with a heat source; scanning the heated conductive circuitry with a non-contact thermal detector; detecting, with the non-contact thermal detector and concurrently with the printing of the conductive circuitry, the faults where the printing head failed to print; and reprinting the faults with the printing head.

Printing an electrical device using flexographic plate with protective features
10334739 · 2019-06-25 · ·

A printed electrical device is formed using a flexographic printing system. A flexographic printing plate having a pattern of raised features includes an active region having a plurality of parallel traces separated by a trace spacing of between 5-40 microns that are used to form active micro-traces that provide an electrical function, and an inactive region adjacent to the active region having one or more protective features that are used to form electrically-inactive features. The protective features are separated from an outermost trace of the plurality of traces by a gap distance of between 60% and 250% of the trace spacing. The flexographic printing plate is used to transfer ink from an anilox roller to a substrate to provide a printed pattern corresponding to the pattern of raised features on the flexographic printing plate.

METHOD AND SYSTEM FOR GENERATING JET PRINTING DATA, ELECTRONIC DEVICE, AND STORAGE MEDIUM

A method and system for generating jet printing data, an electronic device, and a storage medium are provided. The method includes: step 1: obtaining a pad pattern, wherein the pad pattern comprises several highlighted regions; step 2: determining an image scanning angle of each of the highlighted regions in the pad pattern; step 3: scanning and filling each of the highlighted regions based on the corresponding image scanning angle, to obtain a jet printing path; and step 4: generating jet printing data based on the jet printing path. In the method for generating jet printing data of the present disclosure, only a bare PCB or a Gerber file is needed so that the jet printing data can be rapidly and accurately generated and provided to the jet printing system, thereby maximizing the speed for generating jet printing programs, increasing program quality, and operating efficiency.

TEMPLATE, METHOD FOR MANUFACTURING TEMPLATE, AND PATTERN FORMATION METHOD
20190077068 · 2019-03-14 · ·

According to one embodiment, a template includes a base body, and a first film. The base body has a first surface and a second surface. The first surface includes silicon oxide and spreads along a first plane. The second surface crosses the first plane. The first film includes aluminum oxide. A direction from the second surface toward the first film is aligned with a direction perpendicular to the second surface. A thickness of the first film along the direction perpendicular to the second surface is not less than 0.3 nm and not more than 10 m. The first surface includes an unevenness.

APPARATUS FOR FABRICATING ELECTRODE STRUCTURE
20190055662 · 2019-02-21 ·

An apparatus for fabricating an electrode structure includes a high voltage unit, a plating material part facing the high voltage unit, and a transfer roll to which a negative voltage is applied. The high voltage unit includes a high voltage roll, and an insulating sheath configured to cover a surface of the high voltage roll. The high voltage roll is applied with a voltage of about 1 kV to about 100 kV, the plating material part is applied with a positive voltage, and the high voltage unit and the transfer roll rotate.

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
20240397631 · 2024-11-28 · ·

A method of a segmented electroplating golden finger includes a substrate, which is drilled and plated, and including: a. first etching, forming circuit patterns and gold finger parts on the substrate, the gold finger part is composed of several mutually independent gold fingers, a lead channel is provided between the two adjacent gold fingers, and a side lead connected to each gold finger is arranged on the lead channel; b. solder resist, solder resist protection for the etched substrate; c. the gold fingers partly covered with a wet film; d. parallel exposure to perform image transfer; e. gold finger electroplating; f. adhesive glue; g. second etching, removing the leads, completing a finished product.

WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND EXPOSURE PATTERN-RENDERING DATA STRUCTURE

Provided is a method for manufacturing a wiring substrate. The method includes forming a resist layer on a support body, exposing the resist layer, developing the exposed resist layer to form an opening in the resist layer, forming a metal wiring in the opening, and removing the resist layer after the metal wiring is formed. In the exposing of the resist layer, a wiring exposure pattern that corresponds to the metal wiring, and a dummy exposure pattern that does not correspond to the metal wiring are exposed to the resist layer. At least a part of the dummy exposure pattern is located in a region within 200 m from an end portion of the wiring exposure pattern.