Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 m or less.

Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm.sup.2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1:

PAR=Rp/Ra[Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.

A wiring board according to the present disclosure includes an insulation layer, and a wiring conductor positioned on the insulation layer. The wiring conductor includes a phosphorus-containing electroless copper-plating layer positioned on the insulation layer, a nickel-containing electroless copper-plating layer positioned on the phosphorus-containing electroless copper-plating layer, and an electrolytic copper-plating layer positioned on the nickel-containing electroless copper-plating layer.

A solder paste stencil includes, in one embodiment, a substrate defining solder apertures, each aperture wall of each of the solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the aperture walls.

A conductive grid formation system, apparatus, and related methods may include a drum having a conductive surface, an insulation layer coating said surface, and a grid pattern formed in the insulation layer to expose portions of the conductive surface. The drum surface may be rotated into and out of a chemical bath, such that a metallic grid is electrodeposited in the exposed portions of the conductive surface. A polymer sheet may be laminated to the surface of the drum and then removed, such that the metallic grid attaches to the polymer sheet and is removed with the polymer sheet. Heat, pressure, and/or adhesive may be utilized in various steps of the process, to facilitate preferential adhesion of the metallic grid to the polymer sheet.

A conductive grid formation system, apparatus, and related methods may include a drum having a conductive surface, an insulation layer coating said surface, and a grid pattern formed in the insulation layer to expose portions of the conductive surface. The drum surface may be rotated into and out of a chemical bath, such that a metallic grid is electrodeposited in the exposed portions of the conductive surface. A polymer sheet may be laminated to the surface of the drum and then removed, such that the metallic grid attaches to the polymer sheet and is removed with the polymer sheet. Heat, pressure, and/or adhesive may be utilized in various steps of the process, to facilitate preferential adhesion of the metallic grid to the polymer sheet.

A surface-treated copper foil is capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. A resin substrate is provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil has a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 m.

For a wiring board, silicon including a first main surface and a second main surface is a base, a first conductor on the first main surface and a second conductor on the second main surface are connected by a through electrode formed of an electroplating layer disposed on an inner surface of a through hole, a bottom surface of which is the second conductor, and a hilling which is a continuous projecting portion is provided on the inner surface of the through hole from the first main surface to the second main surface in parallel with a depth direction.

There is provided a roughened copper foil which can significantly improve adhesion to an insulating resin and reliability (e.g., hygroscopic heat resistance). The roughened copper foil of the present invention has at least one roughened surface having fine irregularities composed of acicular crystals, wherein the entire surface of the acicular crystals is composed of a mixed phase of Cu metal and Cu.sub.2O.

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 m.