A display device includes a substrate including a pad area, a first conductive pattern disposed in the pad area on the substrate, an insulating layer disposed on the first conductive pattern and overlapping the first conductive pattern, second conductive patterns disposed on the insulating layer, spaced apart from each other, and contacting the first conductive pattern through contact holes formed in the insulating layer, and a third conductive pattern disposed on the second conductive patterns and contacting the insulating layer.

To provide a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface. The light-emitting region is provided on a curved surface in such a manner that a light-emitting element is formed on a flexible substrate supported in a plate-like shape and the flexible substrate deforms or returns.

A display device and method of fabricating the same are provided. The display device includes a substrate and a thin-film transistor formed on the substrate. The thin-film transistor includes a lower gate conductive layer disposed on the substrate, and a lower gate insulating film disposed on the lower gate conductive layer The lower gate insulating film includes an upper surface and sidewalls. The thin-film transistor includes an active layer disposed on the upper surface of the lower gate insulating film, the active layer including sidewalls. At least one of the sidewalls of the lower gate insulating film and at least one of the sidewalls of the active layer are aligned with each other.

An array substrate, a display panel including the array substrate, and a fabrication method of the array substrate are provided. The array substrate includes a base substrate, a light-shielding portion, a thin-film transistor and a capacitor. The light-shielding portion is formed on a first surface of the base substrate. The thin-film transistor is formed on a side of the light-shielding portion away from the base substrate, and includes an active layer. The capacitor is formed on the first surface of the base substrate, and includes a first capacitive electrode and a second capacitive electrode. The first capacitive electrode and the second capacitive electrode are at least partially arranged opposite to each other in a direction perpendicular to the first surface of the base substrate. The first capacitive electrode is provided in a same layer as the light-shielding portion.

Display substrate, method for manufacturing the same and display device are provided. The display substrate includes a base substrate comprising a hole region, an isolation region surrounding the hole region, and a display region surrounding the isolation region. At least one isolation pillar is provided within the isolation region, and each isolation pillar is arranged at a perimeter surrounding the hole region. A light-emitting layer covering the isolation pillar is provided in the display region and the isolation region, and the isolation pillar separates the light-emitting layer located between the hole region and the display region. The isolation pillar includes: a plurality of layers of metal patterns sequentially arranged in a stack on the base substrate; and an insulating film layer which is a layer stack covering the metal patterns and has a shape conforming to shapes of the metal patterns. The display substrate, the method for manufacturing the same, and the display device provided by the present disclosure enables reduced masks, reduced costs and simplified process.

An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.

Proposed are a display substrate, a manufacturing method thereof and a display device. The display substrate includes a base and multiple pixel units disposed on the base, wherein, at least one pixel unit of the multiple pixel units includes multiple sub-pixels with different colors, and at least one sub-pixel of the multiple sub-pixels includes multiple sub-pixel components with the same color; anodes of the sub-pixel components are electrically connected with driving circuits, and the driving circuits are independent of each other, and in a plane perpendicular to the display substrate, a side of the anode of the sub-pixel component away from the base at least includes a partial surface, and a normal of the partial surface is not perpendicular to the base.

A display device and a method of manufacturing the display device are provided. Embodiments of the display device include a substrate including a main portion and a plurality of protrusion patterns protruding outwardly from an edge of the main portion, a display layer on each of the protrusion patterns, a first insulating layer covering the display layer and a second insulating layer on the first insulating layer. Adjacent protrusion patterns are separated by a cutout portion and side surfaces of the adjacent protrusion patterns face each other. The first insulating layer includes adjacent first insulating layers on the adjacent protrusion patterns that face each other and are separated by the cutout portion. The second insulating layer is on a top surface of the first insulating layer on each of the protrusion patterns, and is not on a side surface of the display layer.

A display device according to an embodiment includes: a substrate including a signal wire area and a transistor area; a first layer disposed in the transistor area; a signal wire disposed in the signal wire area; a transistor disposed on the first layer; a first electrode electrically connected to the transistor; and an emission layer and a second electrode disposed on the first electrode, wherein the first layer and the signal wire are disposed on a same layer on the substrate, and the first layer and the signal wire have different thicknesses.

According to one embodiment, a method of manufacturing a display device includes preparing a processing substrate with a lower electrode, a rib, and a partition including a lower portion and an upper portion, forming a first organic layer and a second organic layer spaced apart from the first organic layer, forming a first upper electrode and a second upper electrode spaced apart from the first upper electrode, forming a sealing layer located on the first upper electrode and the second upper electrode, forming a resist covering a part of the sealing layer, performing anisotropic dry etching using the resist as a mask, performing isotropic dry etching using the resist as a mask, and removing the sealing layer exposed from the resist.