Patent classifications
H10K59/1201
Display device and method of manufacturing the same
A display device includes: a display substrate including a display area and a pad area disposed around the display area; a signal wiring disposed over the display area and the pad area on the display substrate; at least one wiring pad including: a pad pattern portion disposed on the pad area of the display substrate and electrically connected to the signal wiring; and a separation pattern portion separated from the pad pattern portion by a separation space; and a printed circuit board attached to the pad area of the display substrate, the printed circuit board including a lead wiring connected to the at least one wiring pad.
Display panel and method of manufacturing display panel
The present disclosure relates to an organic light emitting diode display panel and a method of manufacturing the organic light emitting diode display panel. A display panel, including: a plurality of first light emitting layers arranged in an array in a first direction and a second direction; and a pixel defining layer including a plurality of first openings, wherein each first opening has a reduced size in the first direction, so that the corresponding first light emitting zone defined by the first opening has a first misalignment tolerance range in the first direction, and has a second misalignment tolerance range in the second direction, the corresponding first light emitting zone is allowed to shift in the first direction within the first misalignment tolerance range without overlapping the shaded region of the corresponding first light emitting layer.
Display substrate having spacer for spacing apart carrier injection layer portions of two adjacent sub-pixels, and manufacturing method thereof
A display substrate and a manufacturing method thereof are provided. The display substrate includes a base substrate, as well as a first conductive layer, an organic functional layer and a second conductive layer which are on the base substrate sequentially, and the organic functional layer includes a carrier injection layer including a first carrier injection layer portion and a second carrier injection layer portion which are in a first sub-pixel area and a second sub-pixel area respectively; the display substrate further includes a spacer which separates the first carrier injection layer portion and the second carrier injection layer portion, and the carrier injection layer further includes a third carrier injection layer portion which is separated from the first carrier injection layer portion and the second carrier injection layer portion respectively.
Display apparatus with electrodes having lowered resistance
A display apparatus includes a thin film transistor on the substrate, the thin film transistor including a first semiconductor layer and a first gate electrode overlapping the first semiconductor layer wherein a first gate insulating layer is disposed between the first semiconductor layer and the first gate electrode, and a storage capacitor including a lower electrode including a first lower layer and a first upper layer stacked each other and an upper electrode including a second lower layer and a second upper layer stacked each other, wherein the upper electrode overlaps the lower electrode, and a second gate insulating layer is disposed between the upper electrode and the lower electrode, a display element electrically connected to the thin film transistor, wherein the second upper layer has a thickness greater than a thickness of the first upper layer.
Display device having first transistor, second transistor, and third transistor disposed on different layers
A display device includes an organic light emitting diode, a first transistor driving the organic light emitting diode, a second transistor transmitting a data signal to the first transistor, a third transistor transmitting a first power voltage to the first transistor, wherein a semiconductor pattern of the first transistor is disposed over a semiconductor pattern of the second transistor, a semiconductor pattern of the third transistor is disposed over the semiconductor pattern of the first transistor, a lower transistor insulating film is disposed between the semiconductor pattern of the first transistor and the semiconductor pattern of the second transistor, and an upper transistor insulating film is disposed between the semiconductor pattern of the first transistor and the semiconductor pattern of the third transistor.
Display panel and manufacturing method thereof, display terminal
The present application provides a display panel, a manufacturing method of the display panel, and a display terminal. The display panel includes a base substrate. The base substrate comprises a first substrate, a semi-interpenetrating net structure layer, and a second substrate stacked on each other. The semi-interpenetrating net structure layer is formed by curing after interpenetration between a material of the first substrate in a partially cured state and a material of the second substrate in an uncured state. Accordingly, a bonding strength between the first and second substrates is increased, inert properties between them are reduced, and production yields in separating a glass substrate from the first substrate are improved.
DISPLAY SUBSTRATE, FABRICATION METHOD THEREOF AND DISPLAY APPARATUS
The embodiments of the present disclosure disclose a display substrate, a fabrication method thereof and a display apparatus. The display substrate includes: a base substrate, including a display region and a bonding region located on at least one side of the display region; a conductive layer, located on the base substrate and in the bonding region and including a plurality of first conducive terminals; and an insulation protection layer, located on one side, facing away from the base substrate, of the conductive layer, and having hollow regions and pattern regions, where the hollow regions cover the first conductive terminals, and the pattern regions cover gaps among the plurality of first conductive terminals.
DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE
A display panel and manufacturing method therefor and a display device are provided. The display panel includes: a base substrate; an insulation layer arranged at a peripheral area of the base substrate; at least one encapsulation dam arranged on a surface of the insulation layer away from the base substrate, the encapsulation dam being located in the peripheral area of the base substrate and being arranged around the display area; and at least one groove disposed in the insulation layer, a projection of the at least one groove on the base substrate being located within on a projection of the encapsulation dam on the base substrate.
DISPLAY PANEL, METHOD OF MANUFACTURING THE SAME AND DISPLAY DEVICE
The present disclosure provides a display panel, a manufacturing method thereof, and a display device. The initialization signal line layer in the display panel includes an initialization signal line pattern arranged in each sub-pixel area; the anode layer includes a plurality of anode patterns, and an anode spacing area is formed between adjacent anode patterns; the first auxiliary signal line layer is a grid structure, at least part of the first auxiliary signal line layer is located in the anode spacing area, and the initialization signal line pattern in each sub-pixel area is coupled to the first auxiliary signal line layer.
FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE
A flexible display panel has a display area, a bonding area, and a bending area located between the display area and the bonding area. A flexible substrate includes a first surface and a second surface. Signal leads electrically connected to pixel driving circuits pass through the bending area from the display area and extend to the bonding area. In the pixel driving circuits, at least one pattern layer made of an inorganic material and located between the signal leads and the flexible substrate passes through the bending area from the display area and extends to the bonding area. A second organic material layer is disposed on a side of the signal leads away from the first surface and located at the bending area. A groove is disposed in a film layer away from the signal leads, and is located between the display area and the bonding area.