Embodiments disclosed herein include micro light emitting device (LED) display panels and methods of forming such devices. In an embodiment, a display panel includes a display backplane substrate, a light emitting element on the display backplane, a transparent conductor over the light emitting element, a dielectric layer over the transparent conductor, and a color conversion device over the light emitting element. In an embodiment, the dielectric layer separates the transparent conductor from the color conversion device.

A display apparatus includes a display area and a transmission area on a substrate, and an intermediate area arranged between the display area and the transmission area and including a first sub-intermediate area and a second sub-intermediate area between the first sub-intermediate area and the transmission area, and a number of layers of thin films stacked on the substrate in the first sub-intermediate area is different from a number of layers of thin films stacked on the substrate in the second sub-intermediate area.

Provided are a display panel, a preparation method thereof and a display device. The display panel includes a light-emitting substrate and a color filter substrate; the color filter substrate includes: a substrate, a baffle wall layer and a reflective metal layer. The baffle wall layer is located on one side of the substrate and includes multiple baffle wall structures; the reflective metal layer includes a first reflective subsection covering a surface on a side, close to the light-emitting substrate, of the multiple baffle wall structures; the first reflective subsection includes multiple first metal subsections and multiple second metal subsections; and the multiple first metal subsections are independently disposed, and adjacent ones of the multiple second metal subsections along the first direction are connected to each other.

An encapsulation structure, a display panel and a manufacturing method thereof are provided. The display panel includes a base substrate; a device to be encapsulated; an encapsulation film; and an edge encapsulation member; an orthographic projection of the edge encapsulation member on the base substrate overlaps with an orthographic projection of the edge of the encapsulation film on the base substrate; the encapsulation film includes a first film, a second film, and a third film, the second film is interposed between the first film and the third film, and the first film is in contact with the third film at an edge location to form a stacked-contact portion, and at least the stacked-contact portion of the encapsulation film is covered by the edge encapsulation member, and at the edge location, the edge encapsulation member and the second film have an overlapped part in a direction perpendicular to the base substrate.

A method of manufacturing a display apparatus includes: forming a display element layer above a lower substrate, where the display element layer includes first to third display elements; forming an encapsulation layer on the display element layer; forming first partition walls on the encapsulation layer to define first to third color regions, where the first to third color regions overlap the first to third display elements, respectively, in a view in a direction perpendicular to the lower substrate; forming second partition walls on the first partition walls; forming a quantum dot layer, which includes forming a second color quantum dot layer in the second color region and forming a third color quantum dot layer in the third color region; and removing the second partition walls.

A display device includes a pixel array disposed on a base substrate, a side terminal electrically connected to the pixel array, a connection pad including a first side surface contacting a side surface of the side terminal, and a driving device bonding to a second side surface of the connection pad, where the second side surface is opposite to the first side surface. The side terminal includes a resistance-reducing layer and an upper conductive layer, the resistance-reducing layer includes a first conductive material, the upper conductive layer is disposed on the resistance-reducing layer and includes a second conductive material having an oxidation resistance greater than the first conductive material. A portion of the upper conductive layer is disposed between the connection pad and the resistance-reducing layer such that the resistance-reducing layer is spaced apart from the connection pad.

An organic light-emitting display device includes a substrate; a thin-film transistor layer disposed on the substrate, and including a thin-film transistor including a gate electrode, a source electrode, and a drain electrode; a color filter layer disposed on the thin-film transistor layer and including a red color filter, a green color filter, and a blue color filter; an organic light-emitting element disposed on the color filter layer; and a plurality of out-coupling enhancing members formed in the thin-film transistor layer, wherein the out-coupling enhancing members are spaced from each other at a predetermined spacing and each of the out-coupling enhancing members extends in a stripe shape, and the out-coupling enhancing members vertically overlap the red color filter.

Exemplary methods of backplane processing are described. The methods may include forming a first metal oxide material on a substrate. The methods may include forming a metal layer over the first metal oxide material. The metal layer may be or include silver. The methods may include forming an amorphous protection material over the metal layer. The amorphous protection material may include a second metal oxide material. The methods may include forming a second metal oxide material over the amorphous protection material. The second metal oxide material may include a crystalline material having one or more grain boundaries. The grain boundaries may include one or more voids.

The present application provides a display panel and a manufacturing method thereof. The display panel includes a pixel defining layer, a light-emitting layer, an encapsulation layer, and a color filter functional layer. The pixel defining layer is provided with a first surface and a second surface opposite to each other, and a groove. The light-emitting layer is disposed in the groove. The encapsulation layer is disposed on the first surface of the pixel defining layer and extends to cover the light-emitting layer. The color filter functional layer is disposed in the encapsulation layer and corresponds to the groove.

A display substrate, a display device, and a manufacturing method. The display substrate includes a TFT substrate, and a pixel defining layer provided on the TFT substrate and surrounding a plurality of pixel pits, wherein an electroluminescent device layer, a connection layer, a first encapsulation layer, and a quantum dot layer are sequentially stacked in each pixel pit; the connection layers in the adjacent pixel pits are connected to the side of the pixel defining layer facing away from the TFT substrate; and the connection layers are configured to be electrically connected to the electroluminescent device layers in the two adjacent pixel pits.