A display substrate includes a base substrate, a thin film transistor array layer, a planarization layer, a first electrode and a pixel definition layer, the pixel definition layer defining a plurality of pixel openings, each pixel opening includes a first edge and a second edge adjacent to each other, the pixel definition layer includes a first pixel definition layer parallel to the first edge and a second pixel definition layer parallel to the second edge. A surface of the first pixel definition layer away from the base substrate is located at a level lower than a surface of the second pixel definition layer away from the base substrate, a groove parallel to the first edge is arranged in a surface of the planarization layer away from the base substrate, at least a part of the first pixel definition layer is arranged in the groove.

An OLED display panel, a preparation method therefor, and a display apparatus. The display panel includes a display area including a first sub-pixel, a second sub-pixel and a third sub-pixel displaying different colors; the display area includes a first electrode layer, a pixel defining layer, an organic functional layer and a second electrode layer sequentially arranged on a substrate; the organic functional layer includes a first light-emitting layer in the first sub-pixel, a second light-emitting layer in the second sub-pixel, and a third light-emitting layer covering the display area and having an integrated structure; the orthographic projection, on the substrate, of each of the first light-emitting layer and the second light-emitting layer includes the orthographic projection of an opening on the substrate, which defines a corresponding sub-pixel, of the pixel defining layer and does not overlap with orthographic projections of remaining openings of the pixel defining layer on the substrate.

A display substrate and a manufacturing method therefor, and a display apparatus. The display substrate includes a base substrate, a second power line, a data signal line and a plurality of sub-pixels, wherein at least one sub-pixel includes a pixel driving circuit and a light emitting device connected to the pixel driving circuit, the pixel driving circuit is connected to the data signal line and the light emitting device is connected to the second power line; a semiconductor layer and a plurality of conducting layers, which are disposed at one side of the semiconductor layer away from the base substrate, are disposed on the base substrate, a first electrode is arranged on at least one conducting layer.

A display substrate motherboard and a preparation method thereof, a display substrate and a preparation method thereof are disclosed. The display substrate motherboard includes a base substrate, a first flexible organic layer, a first inorganic layer, a second flexible organic layer and a pixel driving circuit layer. The pixel driving circuit layer includes a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions are insulated from each other. An orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate. An orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate.

A display device and a manufacturing method thereof are provided. The display device includes a flexible panel and a protective film. The flexible panel includes a first panel part, a second panel part, and a bendable part connected between the first panel part and the second panel part. The protective film is bonded to a surface on a non-display side of the flexible panel, and includes a first film part bonded to the first panel part and a second film part bonded to the second panel part. The flexible panel is bent at the bendable part so that the first panel part and the second panel part are overlapped in a first direction perpendicular to the surface.

A display device and a manufacturing method thereof are disclosed. The display device includes a base substrate and at least one pixel circuit provided on the base substrate, and the pixel circuit includes a driving transistor, a first transistor, and a second transistor; the driving transistor includes a control electrode, a first electrode, and a second electrode; the first transistor includes a first active region, the second transistor includes a second active region, the driving transistor includes a fourth active region, at least one of a doping concentration of the first active region and a doping concentration of the second active region is greater than a doping concentration of the fourth active region.

A display device according to an aspect of the disclosure includes a first metal protrusion being in contact with a first power-source trunk wire, and a second metal protrusion being in contact with a second power-source trunk wire. A first bank defining the end of an organic sealing film includes the first metal protrusion, the second metal protrusion, and a first resin protrusion. The first resin protrusion overlaps the first and second metal protrusions. The first resin protrusion has a frame shape.

Methods and apparatus for forming organic light emitting diode (OLED) structures disposed on a substrate are provided. In one embodiment, a method for forming an organic light emitting diode (OLED) substrate is provided that includes forming a first conductive layer on a substrate in a first direction, forming a dielectric layer on a portion of the first conductive layer, wherein the dielectric layer includes a well having a portion of the first conductive layer exposed, depositing an organic material into the well and on the dielectric layer continuously in the second direction and between the two bus bars, and forming a second conductive layer on the organic material continuously in a second direction orthogonal to the first direction and between two bus bars, wherein the second conductive layer is in direct contact with the bus bars on opposing sides thereof; and depositing an encapsulating layer on the second conductive layer continuously in the second direction and fully cover the second conductive layer.

A light-emitting device includes, on a substrate, a red pixel electrode and a green pixel electrode, a common electrode, and a blue pixel electrode, in order from the substrate side, and includes a transparent region adjacent to a light-emitting region including a position overlapping the red light-emitting layer, the green light-emitting layer, and the blue light-emitting layer in a plan view. At least a part of the blue light-emitting layer overlaps the red light-emitting layer and the green light-emitting layer adjacent to the red light-emitting layer in the plan view.

A light-emitting element includes: a first electrode; a first carrier transport layer in electrical contact with the first electrode; a second electrode separated from the first electrode; a second carrier transport layer in electrical contact with the second electrode; and a light-emitting layer, wherein at least part of the light-emitting layer overlaps on part of the first carrier transport layer, and part of the light-emitting layer overlaps on part of the second carrier transport layer, and in plan view, the first carrier transport layer and the second carrier transport layer face each other with the light-emitting layer provided in between.