The present application provides a display device and a manufacturing method thereof. The display device includes a transparent display region and a main display region. The display device further includes a pixel defining layer. The pixel defining layer includes a first pixel defining layer and a second pixel defining layer. The first pixel defining layer is positioned in the transparent display region. The second pixel defining layer is positioned in the main display region. An absorbance of the first pixel defining layer is less than an absorbance of the second pixel defining layer.

In some embodiments, the present disclosure relates to a method of forming a display device, comprising: forming a first reflector electrode and a second reflector electrode over an interconnect structure, wherein the first reflector electrode is laterally separated from the second reflector electrode; depositing a first isolation layer over the first and second reflector electrodes; forming a first masking layer directly overlying the first reflector electrode; depositing a second isolation layer over the first isolation layer and over the first masking layer; forming a second masking layer over the second isolation layer and directly overlying the second reflector electrode; performing a first removal process to remove portions of the first and second isolation layers that do not directly underlie the first or second masking layers; and performing a second removal process to remove the first and second masking layers.

A display panel, a method for manufacturing the display panel, and a display apparatus are provided. The display panel has pixel regions and a non-pixel region, and the non-pixel region is at least located between two adjacent pixel regions. The display panel includes a substrate, a light-emitting element layer located at a side of the substrate and comprising an organic common layer, and a first opening located in one of the at least one non-pixel region. The first opening includes a first sidewall and a second sidewall. The first sidewall is a side surface of a first layer, and the second sidewall is a side surface of a second layer. The first layer and the second layer are located at a side of the organic common layer facing towards the substrate, and the organic common layer forms a recessed structure at the first opening.

The present disclosure provides a display substrate and a method for manufacturing the same and a display device. The display substrate includes: sub-pixels disposed on a base substrate and each including a sub-pixel aperture area, a reflective layer, an insulating layer, independent anode patterns, a light-emitting function layer and a cathode. An orthographic projection of the reflective layer onto the base substrate at least partially overlaps an orthographic projection of the sub-pixel aperture area onto the base substrate. The insulating layer is on one side of the reflective layer away from the base substrate. The anode patterns are on one side of the insulating layer away from the base substrate, and each of orthographic projections of the anode patterns onto the base substrate at least partially overlaps the orthographic projection of the sub-pixel aperture area onto the base substrate. The light-emitting function layer is on one side of the anode patterns away from the base substrate. An orthographic projection of the light-emitting function layer onto the base substrate is within the orthographic projection of the sub-pixel aperture area onto the base substrate. The cathode is on one side of the light-emitting function layer away from the base substrate. An orthographic projection of the cathode onto the base substrate covers the orthographic projection of the light-emitting function layer onto the base substrate.

An apparatus for manufacturing a display device includes: a support to mount a display substrate having a pixel area; a multi-layered film disposed above the display substrate and including a light-transmissive base layer and a source layer disposed on the base layer facing the pixel area and including an organic material; and a laser device spaced apart from the multi-layered film to radiate a laser beam toward the multi-layered film. The source layer is capable of absorbing the laser beam.

Provided are a display panel and a manufacturing method thereof, and a display device. The display panel includes: a base substrate including a display area and a peripheral area including a first peripheral area, and an edge of the first peripheral area is of a first curvature greater than zero; a plurality of sub-pixels, data lines and gate lines; a gate driving circuit located at the display area and including multistage gate driving units, one or more stages include a first and a second gate driving sub circuit; a plurality of control signal lines, at least a part of at least one control signal line is of a second curvature greater than zero; a plurality of data signal input lines; and a multiplexing circuit including a plurality of multiplexing units, each of which is connected to the control signal lines, one data signal input line, and at least two data lines.

A method of manufacturing a display apparatus includes forming a first electrode on a substrate, forming a pixel-defining layer on the first electrode, the pixel-defining layer including an opening through which at least part of the first electrode is exposed, and performing a first dry cleaning on a surface of the at least part of the first electrode that is exposed through the opening. An indium-fluorine bond is formed on the surface of the at least part of the first electrode through the first dry cleaning.

An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. The apparatus includes a stage; a laser module disposed above the stage and configured to output a laser beam; a scanner configured to receive the laser beam output from the laser module and irradiate the laser beam onto the stage; and a controller configured to control the laser module to irradiate the laser beam to a processing position while moving both the scanner and the stage in a first direction according to the processing position and a shape of a processing pattern.

The number of masks and photolithography processes used in a manufacturing process of a semiconductor device are reduced. A first conductive film is formed over a substrate; a first insulating film is formed over the first conductive film; a semiconductor film is formed over the first insulating film; a semiconductor film including a channel region is formed by etching part of the semiconductor film; a second insulating film is formed over the semiconductor film; a mask is formed over the second insulating film; a first portion of the second insulating film that overlaps the semiconductor film and second portions of the first insulating film and the second insulating film that do not overlap the semiconductor film are removed with the use of the mask; the mask is removed; and a second conductive film electrically connected to the semiconductor film is formed over at least part of the second insulating film.

A display substrate includes a supporting material layer having at least one flexible material sub-layer and at least one blocking sub-layer, which can be alternately and successively arranged in layers. One blocking sub-layer is at a topmost sub-layer of the supporting material layer, and is provided with a well, located in a display area and configured for accommodating a display component therewithin. One or more of the at least one flexible material sub-layer or the at least one blocking sub-layer is configured as a target material layer. The target material layer includes a planar portion and a protruding portion over the planar portion. An orthographic projection of the protruding portion on a bottom surface of the supporting material layer forms a ring-like structure having an opening that covers an orthographic projection of a bottom surface of the well on the bottom surface of the supporting material layer.