The present disclosure provides an optical fingerprint identification unit, a display panel, a method for manufacturing an optical fingerprint identification unit and a method for identifying a fingerprint. The optical fingerprint identification unit includes a substrate, and a light source, a photoluminescent layer and a light sensor above the substrate. The light source is configured to emit visible light. The photoluminescent layer is configured to receive the visible light reflected by a fingerprint and convert the received visible light into non-visible light. The light sensor is configured to detect the non-visible light.

The application relates to the technical field of display, and discloses a display substrate, a method for preparing the same, and a display panel. The display substrate includes a base substrate, a pixel circuit layer and a flat layer sequentially arranged on the base substrate, and anodes located on a side, away from the base substrate, of the flat layer and corresponding to pixel units one by one, wherein a plurality of grooves of which openings are away from the base substrate are formed in the flat layer, a boss is formed between each two adjacent grooves, and an orthographic projection of each pixel unit on the base substrate is overlapped with an orthographic projection of a corresponding groove on the base substrate; and in each pixel unit: the anode is formed on the boss, a hollow structure is arranged at a part, opposite to a corresponding groove of the flat layer, of the anode, and an orthographic projection of the anode on the base substrate is located within an orthographic projection of the boss on the base substrate. The flat layer is provided with openings and thus can accommodate anode deficiencies generated by the anodes; and the hollow structures of the anodes can avoid dark spots finally caused by anode deformation generated by high-pressure washing, and therefore, the yield is increased.

A display device including a display panel having a display area and a non-display area, the non-display area being disposed at a peripheral portion of the display area and having a bending area; an integrated circuit (IC) disposed in the non-display area to drive the display panel; a first layer formed between the display area and the IC and covering the bending area; and a first member covering the IC and the first layer and overlapping with the bending area.

The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.

Disclosed herein is a display substrate of a display panel, comprising: a support; a second layer on the support; a window extending through the second layer and optically coupled with an image sensor; and a sidewall at least partially surrounding the window; wherein the sidewall is configured to attenuate transmission of light through the sidewall.

An organic light emitting diode display device includes a substrate, a driving transistor, a switching transistor, a first light absorbing layer, an organic insulating layer, and a sub-pixel structure. The substrate includes a first region and a second region. The driving transistor is disposed in the first region on the substrate. The switching transistor is disposed in the second region on the substrate, and includes a metal-oxide-based semiconductor. The first light absorbing layer is disposed on the driving and switching transistors. The organic insulating layer is disposed directly on the first light absorbing layer. The sub-pixel structure is disposed on the organic insulating layer.

Systems and methods are described for a display panel and a method of manufacturing the display panel. The systems and methods may provide for a substrate having a first surface and a second surface that face each other, a display unit including an organic light-emitting device arranged on the first surface of the substrate; and a thin-film encapsulation layer arranged on the display unit to shield the display unit, wherein an edge of the first surface or an edge of the second surface are inclined with respect to the first surface or the second surface. The inclined surfaces are designed to prevent damage to the display due to fine cracks during the manufacturing process as the display panel is trimmed or cut from a single base member. A display panel having improved strength characteristics may be manufactured, as well.

A display substrate including: a base substrate with a display region, an encapsulation region and an edge region on a periphery of the encapsulation region, the edge region includes a bonding region on at least one side of the base substrate; a plurality of stacked inorganic film layers on a side of the base substrate; a plurality of first grooves, at the edge region, spaced apart from each other in a direction distal from the encapsulation region, and extending along a periphery of the base substrate, at least one of the plurality of first groove runs through at least one inorganic film layer of the plurality of inorganic film layers, and a distance between each first groove and the display region is larger than that between each first groove and an edge of the base substrate; and an organic layer.

A light-emitting element includes: a light-reflective first electrode; a light-emitting layer above the first electrode; a light-transmissive second electrode above the light-emitting layer; a first light-transmissive layer on the second electrode; and a second light-transmissive layer on the first layer. First optical cavity structure is formed between surface of the first electrode facing the light-emitting layer and surface of the second electrode facing the light-emitting layer. The first optical cavity structure corresponds to, as peak wavelength, first wavelength longer than peak wavelength of light emitted from the light-emitting layer. Second optical cavity structure is formed between the surface of the first electrode facing the light-emitting layer and an interface between the first layer and the second layer. The second optical cavity structure corresponds to, as peak wavelength, second wavelength shorter than the first wavelength. The first and second layers differ in refractive index from each other by 0.3 or greater.

A display device includes a base substrate, a first transistor, a second transistor, an organic light emitting diode, and a capacitor electrically connected to the first thin film transistor. The first transistor includes a first semiconductor pattern below a first interlayer insulation layer and a first control electrode above the first interlayer insulation layer and below a second interlayer insulation layer. The second transistor includes a second control electrode above the first interlayer insulation layer and below the second interlayer insulation layer. A second semiconductor pattern is above the second interlayer insulation layer.