An organic light-emitting display device includes a base substrate, a pixel array, a first power voltage wiring and a second power voltage wiring. The base substrate includes a pixel area and a peripheral area. The pixel array is disposed in the pixel area. The first power voltage wiring is disposed in the peripheral area and includes a first lower power voltage line and a first upper power voltage line. The first upper power voltage line is disposed on and contacts the first lower power voltage line. The second power voltage wiring is disposed in the peripheral area and includes a second lower power voltage line and a second upper power voltage line. The second upper power voltage line is disposed on and contacts the second lower power voltage line. The first upper power voltage line overlaps the second lower power voltage line in a plan view.

The disclosure provides an OLED display substrate, a manufacturing method thereof, and a display device, wherein the OLED display substrate is provided with a display area and an edge area surrounding the display area, the OLED display substrate includes a back plate and a pixel-defining layer on the back plate, and a protrusion is provided on the back plate at the edge area of the OLED display substrate.

A TFT array substrate includes a substrate layer and a metal layer disposed on the substrate layer. The metal layer includes a metal layer bridging structure having a first metal layer and a bridging second metal layer. An insulating layer is disposed between the first metal layer and the bridging second metal layer. The first metal layer includes two segments of a first segment and a second segment of the first metal layer, which are disposed at intervals. The first segment and the second segment of the first metal layer are connected by the bridging second metal layer. The TFT array substrate has a bending region adopting a new metal layer routing structure, and routing of the first metal layer in the bending region is prevented from passing through two holes of a filling layer (OILD), thereby effectively reducing the risk of subsequent breakage due to over-etching.

A display panel and manufacturing method thereof are provided. The display panel includes a substrate, a first electrode, a hole injection layer, a hole transport layer, an electron blocking layer, an organic electroluminescent layer, a hole blocking layer, an electron transport layer, an electron injection layer, and a second electrode arranged sequentially. The electron blocking layer corresponding to a green sub-pixel region of the organic electroluminescent layer is made of a p-type green light host material. Accordingly, the present invention effectively simplifies a manufacturing process, adjusts and balances charge carriers, and improves device performance.

A display panel and manufacturing method thereof are provided. The display panel includes a substrate, a first electrode, a hole injection layer, a hole transport layer, an electron blocking layer, an organic electroluminescent layer, a hole blocking layer, an electron transport layer, an electron injection layer, and a second electrode arranged sequentially. The electron blocking layer corresponding to a red sub-pixel region of the organic electroluminescent layer is made of a p-type red light host material. Accordingly, the present invention effectively simplifies a manufacturing process, adjusts and balances charge carriers, and improves device performance.

An array substrate, a manufacturing method thereof, and a display panel are provided. The array substrate includes a base substrate, an array layer disposed on the base substrate, a light-emitting device layer disposed on the array layer, and an encapsulation layer covering the light-emitting device layer. The base substrate includes a first portion defined in a main display region and a second portion defined in a functional region, the second portion includes a first surface close to the array layer, and the first surface includes a first convex surface protruding in a direction toward to the array layer.

A peeling method at low cost with high mass productivity is provided. A silicon layer having a function of releasing hydrogen by irradiation with light is formed over a formation substrate, a first layer is formed using a photosensitive material over the silicon layer, an opening is formed in a portion of the first layer that overlaps with the silicon layer by a photolithography method and the first layer is heated to form a resin layer having an opening, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, a conductive layer is formed to overlap with the opening of the resin layer and the silicon layer, the silicon layer is irradiated with light using a laser, and the transistor and the formation substrate are separated from each other.

The present invention provides a display device and a manufacturing method thereof, including: forming a device board; forming a color resist layer on the device board; forming a black matrix layer on the device board, wherein at least a portion of the color resist blocks is defined in a grid region in the black matrix layer, and at least a portion of an orthographic projection of the color resist blocks on the device board covers at least a portion of an orthographic projection of an adjacent part of the black matrix layer on the device board; and forming a planarization layer covering the color resist blocks and the black matrix layer.

An organic light emitting diode display device includes a substrate. A first protective layer is disposed on the substrate. A conductive line is disposed on the first protective layer. A second protective layer is disposed on the conductive line. A first electrode is disposed on the second protective layer. An organic light emitting layer is disposed on the first electrode. A second electrode is disposed on the light emitting layer. The first electrode is symmetric with respect to a center of the conductive line.

A display panel and preparation method thereof are disclosed, the display panel including: a thin film transistor structure layer, an organic light-emitting diode (OLED) light-emitting layer including an anode, an encapsulation layer disposed on the OLED light-emitting layer, a color filter disposed on the encapsulation layer, wherein the color filter includes a plurality of color resist units and a black matrix around the color resist units, a planarization layer covering one side of the color filter away from the encapsulation layer, and an anti-reflection layer disposed on one side of the planarization layer away from the encapsulation layer.