A display apparatus includes a thin film transistor facing a substrate with a buffer layer therebetween and including a semiconductor layer, a channel region, a source region, a drain region, and a gate electrode; a conductive pattern between the substrate and the semiconductor layer and connected to the semiconductor layer, the conductive pattern facing the semiconductor layer with the buffer layer therebetween; a contact hole in the buffer layer and exposing the conductive pattern to outside the buffer layer; and a display element which is electrically connected to the thin film transistor. The source region or the drain region extends through the contact hole in the buffer layer, to contact the conductive pattern and connect the semiconductor layer to the conductive pattern.

A method for manufacturing a display device according to an embodiment includes: forming a display panel including a first substrate, a second substrate facing the first substrate, an emission layer disposed between the first substrate and the second substrate, a pad portion disposed on the first substrate, and a thin film encapsulation layer disposed on the pad portion; removing the thin film encapsulation layer disposed on the pad portion by using a plasma processing device; and attaching a flexible circuit board on which an integrated circuit chip is mounted to the pad portion exposed by removing the thin film encapsulation layer.

A foldable display device including a lower module having a first side end disposed in a first side area of the foldable display device; a display module including: a main region including a display area and a first side end disposed in the first side area; a sub region disposed under the lower module, overlapping the main region, and having a first side end disposed in the first side area; and a bent region disposed between the first side ends of the main region and the sub region and having an outer surface between an upper surface of the main region and a lower surface of the sub region, and an inner surface between a lower surface of the main region and an upper surface of the sub region; and a functional module and a window module each having a first side end disposed in the first side area.

The present disclosure provides a display substrate and a manufacturing method thereof, and a display device. The display substrate includes a base substrate and a driving circuit layer located on the base substrate, each of the plurality of pixel units comprises a light emitting element, wherein a display surface of the display substrate comprises a central display region and a plurality of peripheral display regions located around the central display region, a light emitting element in the central display region is an organic light emitting diode, and a light emitting element in at least one of the plurality of peripheral display regions is a micro light emitting diode.

A display apparatus including a first display area, a second display area including a transmissive area, and a peripheral area outside the first display area and the second display area. The display apparatus includes a substrate, a first pixel circuit on the substrate and in the first display area, and an organic insulating layer on the first pixel circuit and covering the first display area and the second display area. A thickness of the organic insulating layer in the second display area is less than a thickness of the organic insulating layer in the first display area.

A display device is provided that includes a substrate, a first conductive layer disposed on the substrate, a first insulating layer disposed on the first conductive layer, a second insulating layer disposed on the first insulating layer, the second insulating layer including a contact hole exposing the first conductive layer, a second conductive layer disposed on the first insulating layer and electrically connected to the first conductive layer through the contact hole, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer and the second conductive layer, the first electrode being electrically connected to the second conductive layer, a light emitting layer disposed on the first electrode, and a second electrode disposed on the light emitting layer.

A display device includes a substrate, a first light-emitting unit, a second light-emitting unit, a first light conversion unit, a second light conversion unit, a first buffer layer, a second buffer layer, and a sidewall buffer layer. The first light-emitting unit and the second light-emitting unit are disposed on the substrate. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit and has a first curved bottom surface. The second buffer layer is disposed between the second light conversion unit and the second light-emitting unit and has a second curved bottom surface. The sidewall buffer layer directly contacts the first light conversion unit and the second light conversion. A width of the first curved bottom surface is different from a width of the second curved bottom surface.

An organic-light-emitting-diode device and a fabricating method thereof, a displaying base plate and a displaying device, wherein the organic-light-emitting-diode device includes a substrate, and an anode layer, an organic functional layer and a cathode layer that are provided in stacking on one side of the substrate, wherein the organic functional layer includes a first functional layer, a second functional layer and a light emitting layer that are provided in stacking, and the first functional layer is provided closer to the anode layer; and a HOMO energy level of the second functional layer is deeper than both of a HOMO energy level of the first functional layer and a HOMO energy level of a host material of the light emitting layer.

A display backplane includes a substrate, a thin film transistor over the substrate, and a pixel capacitor assembly over a side of the thin film transistor away from the substrate, and an orthographic projection of the pixel capacitor assembly on the substrate covers at least one portion of an orthographic projection of the thin film transistor on the substrate. The pixel capacitor assembly includes a first electrode, a passivation layer, and a second electrode, sequentially over a side of the thin film transistor away from the substrate, and an orthographic projection of the first electrode on the substrate is overlapped with the orthographic projection of the thin film transistor on the substrate. A display panel including the display backplane can further include an OLED component, arranged over a side of the pixel capacitor assembly away from the substrate.

A display apparatus is disclosed that includes contact holes formed to expose at least a portion of a conductive layer or a semiconductor layer without damage to the surface of the conductive layer or the semiconductor layer, and a method of manufacturing the display apparatus. The display apparatus includes a substrate, a conductive mound arranged on the substrate, a first insulating mound arranged on the substrate, and a semiconductor layer including a first region arranged on the conductive mound, and a second region arranged on the first insulating mound. The second region of the semiconductor layer substantially covers an upper surface of the first insulating mound.