Patent classifications
H10K71/236
METHOD OF MANUFACTURING MULTILAYER PEROVSKITE STRUCTURE, AND MULTILAYER PEROVSKITE STRUCTURE AND SOLAR CELL MANUFACTURED USING THE SAME
The present disclosure discloses a method of manufacturing a multilayer perovskite structure, and a multilayer perovskite structure and solar cell manufactured using the same. The method of manufacturing a multilayer perovskite structure according to an embodiment of the present disclosure includes a step of forming a first perovskite layer using a compound including a first perovskite precursor on a base substrate; a step of forming a second perovskite layer using a compound including a second perovskite precursor on a donor substrate; and a step of laminating the first and second perovskite layers so that the first and second perovskite layers contact each other and then applying heat or pressure to form a multilayer perovskite structure.
Display device including capping layer covered source and drain electrodes
A display device includes: a thin-film transistor on a substrate, the thin-film transistor including on the substrate: an active layer; a gate electrode overlapping the active layer; a source electrode and a drain electrode electrically connected to the active layer and including a first metal material; and a first capping layer which covers each of the source electrode and the drain electrode, the first capping layer having a Young's modulus greater than that of the first metal material.
Method of manufacturing organic light-emitting device and method of manufacturing display unit
There is provided a method of manufacturing an organic light-emitting device including: forming a first organic material layer on a substrate; and forming a mask in a first region on the first organic material layer, and then selectively removing the first organic material layer to form a first organic layer in the first region.
Semiconductor patterning
A technique, comprising: forming a stack comprising a semiconductor layer for providing the semiconductor channels of one or more transistors, and an insulator layer; and patterning the stack so as to form in a single process both: (i) one or more interconnection holes for connecting a conductor level on one side of the stack to a conductor level on the opposite side of the stack; and (ii) one or more leakage reduction trenches for reducing leakage paths via the semiconductor between conductor elements on one side of the stack.
Method for repairing disconnecting signal line of thin film transistor (TFT) array substrate
A method for repairing a disconnecting signal line of a thin film transistor (TFT) array substrate including: providing a TFT array substrate with a disconnecting signal line; defining a through hole at an edge of an overlapping area of the repairing line and the disconnecting signal line; printing ink in the through hole, the ink completely covers the through hole, the ink contains a plurality of metal nanoparticles; and curing the ink to make the repairing line and the disconnecting signal line to be connected.
Receptacle comprising a formulation containing at least one organic semiconductor
The present invention relates to vessels comprising a formulation including at least one organic semiconductor, wherein the formulation is in contact with at least one absorption material. The invention further describes a process for producing the vessel and for the use thereof.
METHOD FOR REPAIRING DISCONNECTING SIGNAL LINE OF THIN FILM TRANSISTOR (TFT) ARRAY SUBSTRATE
A method for repairing a disconnecting signal line of a thin film transistor (TFT) array substrate including: providing a TFT array substrate with a disconnecting signal line; defining a through hole at an edge of an overlapping area of the repairing line and the disconnecting signal line; printing ink in the through hole, the ink completely covers the through hole, the ink contains a plurality of metal nanoparticles; and curing the ink to make the repairing line and the disconnecting signal line to be connected.
METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING DISPLAY UNIT
There is provided a method of manufacturing an organic light-emitting device including: forming a first organic material layer on a substrate; and forming a mask in a first region on the first organic material layer, and then selectively removing the first organic material layer to form a first organic layer in the first region.
DISPLAY PANEL, PREPARING METHOD THEREOF, AND DISPLAY DEVICE
Provided are a display panel, a preparing method thereof, and a display device. The display panel includes a base substrate, light-emitting units disposed on a side of the substrate and disposed in the display region, a color filter layer disposed on a side of the light-emitting units facing away from the substrate and including multiple color filter units, and an optical adjustment layer disposed on a side of the base substrate and including multiple optical adjustment units. In the thickness direction of the display panel, a color filter unit at least partially overlaps a light-emitting unit. In a first direction, at least one of the optical adjustment units is disposed between adjacent color filter units. The refractive index of the color filter unit is greater than the refractive index of the optical adjustment unit.
MOTHER PLATE, METHOD FOR MANUFACTURING MOTHER PLATE, METHOD FOR MANUFACTURING MASK, AND OLED PIXEL DEPOSITION METHOD
Provided are a mother plate, a method of manufacturing the mother plate, a method of manufacturing a mask, and a method of depositing organic light-emitting diode (OLED) pixels. A method of manufacturing a mother plate 20 used to electroform a mask, according to the present invention, includes (a) providing a substrate 21 made of conductive monocrystalline silicon, and (b) forming an insulator 25 having patterns, on at least one surface of the substrate 21.