Systems and methods for operating an antenna assembly. The methods comprise: receiving a first command for tuning the antenna assembly to a first frequency selected from a plurality of different frequencies to which a strip antenna of the antenna assembly is tunable; selectively connecting ground to the strip antenna at a first location along an elongated length of the strip antenna; and connecting a transceiver to the strip antenna at a second location along the elongated length of the strip antenna using a first tank circuit of a plurality of tank circuits provided with the antenna assembly. The tank circuits are respectively associated with the different frequencies to which the strip antenna is tunable. The first tank circuit is associated with the first frequency to which the strip antenna is to be tuned.

A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.

A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.

Various embodiments are described that relate to an antenna. In one embodiment, the antenna can be a low profile, multi-band (e.g., dual band), emulated GPS constellation antenna. In one embodiment, the antenna can form a cube with two open sides and four circuit board sides. The four circuit boards can include a first hardware portion that allows functioning in a higher frequency band and a second hardware portion that allows functioning in a lower frequency band.

Various embodiments are described that relate to an antenna. In one embodiment, the antenna can be a low profile, multi-band (e.g., dual band), emulated GPS constellation antenna. In one embodiment, the antenna can form a cube with two open sides and four circuit board sides. The four circuit boards can include a first hardware portion that allows functioning in a higher frequency band and a second hardware portion that allows functioning in a lower frequency band.

An electronic device is provided. The electronic device includes: a first radiator, a second radiator, a first signal source, and a second signal source. The first radiator is coupled to the second radiator, the first signal source is electrically connected to the first radiator, the second signal source is electrically connected to the second radiator, the first signal source is a signal source used when the electronic device works at a positioning frequency band or works at a first WiFi frequency band, and the second signal source is a signal source used when the electronic device works at a second WiFi frequency band.

An electronic device is provided. The electronic device includes: a first radiator, a second radiator, a first signal source, and a second signal source. The first radiator is coupled to the second radiator, the first signal source is electrically connected to the first radiator, the second signal source is electrically connected to the second radiator, the first signal source is a signal source used when the electronic device works at a positioning frequency band or works at a first WiFi frequency band, and the second signal source is a signal source used when the electronic device works at a second WiFi frequency band.

A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a first mold layer, and a second mold layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first mold layer seals the first semiconductor device. The second mold layer seals the second semiconductor device. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The first mold layer and the second mold layer are made of different materials.

A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a first mold layer, and a second mold layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first mold layer seals the first semiconductor device. The second mold layer seals the second semiconductor device. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The first mold layer and the second mold layer are made of different materials.

A self-controlled radio frequency (RF) filtering unit that may include (i) a frequency bank that comprises first till fourth band pass filters (BPFs) having first till fourth frequency bands respectively; wherein at least one harmonic of at least one fundamental frequency within the first frequency band pass an interference risk for at least one other frequency band; (ii) a measurement circuit configured to measure the input power received in two or more frequency bands and to provide a power measurement result; (ii) an input RF switch comprising a first RF switch input port, a first RF switch output port, and a second RF switch output port; wherein input RF switch is configured to select a selected RF switch output port, based at least in part on the power measurement result, out of the first and second RF switch output ports; wherein the first RF switch output port is RF coupled to an input of the second BPF; wherein the second RF switch output port is RF coupled to inputs of the first BPF, the third BPF and the fourth BPF; and (ii) an output RF switch comprising a second RF switch input port, a third RF switch input port, and a third RF switch output port; wherein output RF switch is configured to select, based at least in part on the power measurement result, a selected RF switch input port out of the second and third RF switch input ports; wherein the second RF switch input port is RF coupled to outputs of the first BPF and the second BPF; and wherein the third RF switch input port is RF coupled to outputs of the third BPF and the fourth BPF.