A radio-frequency module includes a multilayer substrate, a first semiconductor device, and a second semiconductor device. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first semiconductor device includes a first power amplifier circuit. The second semiconductor device includes at least one of a low-noise amplifier circuit, a switching circuit, or a control circuit. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face.

An antenna device includes first and second radiating elements, and an antenna coupling element. The antenna coupling element includes a primary coil electrically connected between the first radiating element and a feed circuit and a secondary coil inductively coupled to the primary coil and electrically connected between the second radiating element and a ground. A capacitor is provided between the primary coil and the secondary coil, thus causing current to flow from the primary coil to the secondary coil or the second radiating element via the capacitor even at an anti-resonant frequency of the first radiating element.

An antenna structure of reduced size but operating at multiple frequencies, applied to an electronic device, includes a housing, a system ground plane, and a first feed point. The housing has at least one portion made of metal material and defines a first gap and a second gap. The housing between the first gap and the second gap forms a first radiation portion. The system ground plane is positioned in the housing and defines a first slit. The first slit corresponds to the first radiation portion and communicates with the second gap. The first feed point is positioned on the first radiation portion and is electrically connected to a first feed source for feeding current and signal to the first radiation portion.

An antenna module includes a first substrate, a second substrate, a connection member connected between the first substrate and the second substrate, and an FEM disposed on the connection member. A radiating element is disposed on the first substrate. An RFIC for supplying a radio frequency signal to the radiating element is disposed on the second substrate. The connection member transmits radio frequency signals between the RFIC and the radiating element. The FEM amplifies radio frequency signals transmitted between the RFIC and the radiating element. The FEM is disposed at a position between a connecting point with the first substrate and a connecting point with the second substrate on the connection member.

An antenna module includes a first substrate, a second substrate, a connection member connected between the first substrate and the second substrate, and an FEM disposed on the connection member. A radiating element is disposed on the first substrate. An RFIC for supplying a radio frequency signal to the radiating element is disposed on the second substrate. The connection member transmits radio frequency signals between the RFIC and the radiating element. The FEM amplifies radio frequency signals transmitted between the RFIC and the radiating element. The FEM is disposed at a position between a connecting point with the first substrate and a connecting point with the second substrate on the connection member.

A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.

An antenna apparatus includes two feeding parts, a filter matching network, and a radiator. The filter matching network includes a first port, a second port, and a third port. A first feeding part is electrically connected to the first port, a second feeding part is electrically connected to the second port, and the radiator is electrically connected to the third port. The first feeding part is configured to feed a low frequency signal and an intermediate frequency signal, the second feeding part is configured to feed a high frequency signal, the low frequency signal, the intermediate frequency signal, and the high frequency signal are respectively fed into the filter matching network by using the first feeding part and the second feeding part, and the filter matching network is configured to improve isolation between the low frequency signal and the intermediate frequency signal, and the high frequency signal.

An antenna device according to an embodiment includes an antenna including a power feeding point, a matching circuit having a variable impedance, a loop type probe being installed near the power feeding point and receiving a radio wave radiated from the antenna, a power detector detecting electric power of the radio wave received by the loop type probe, and a control circuit controlling an impedance of the matching circuit on the basis of power information output from the power detector.

This disclosure is directed to a broadband notch radiator antenna. In one aspect, a broadband notch radiator antenna includes a dielectric substrate having a first surface and a second surface. A conductive material is disposed on the first surface to form a horn-shaped dielectric notch antenna. The conductive material disposed on the first surface includes a meander line antenna connected to an edge of the horn-shaped notch. One or more microstrip feed lines and one or more inductance matching circuits are disposed on the second surface. The one or more inductance matching circuits are connected to the one or more feed lines.

A radiating system of a wireless device transmits and receives electromagnetic wave signals in a frequency region and comprises an external port, a radiating structure, and a radiofrequency system. The radiating structure includes: a ground plane layer with a connection point; a radiation booster with a connection point and being smaller than 1/30 of a free-space wavelength corresponding to a lowest frequency of the frequency region; and an internal port between the radiation booster connection point and the ground plane layer connection point. The radiofrequency system includes: a first port connected to the radiating structure's internal port; and a second port connected to the external port. An input impedance at radiating structure's disconnected internal port has a non-zero imaginary part across the frequency region. The radiofrequency system modifies impedance of the radiating structure to provide impedance matching to the radiating system within the frequency region at the external port.