A die attachment structure can include: a base; a die located above a first surface of the base; a first adhesive layer located on a back surface of the die, wherein the die is pasted on the first surface of the base at least by the first adhesive layer; and a second adhesive layer at least partially covering the sidewalls of the die.

A chip package structure is provided. The chip package structure includes a carrier substrate. The chip package structure includes a chip structure over the carrier substrate. The chip structure includes a semiconductor substrate and a device layer, the semiconductor substrate has a front surface and a back surface opposite to the front surface, the front surface faces the carrier substrate, and the device layer is between the front surface and the carrier substrate. The chip package structure includes a heat dissipation lid over the back surface of the semiconductor substrate. The heat dissipation lid has a plate portion and a first protruding portion under the plate portion, and the first protruding portion extends into the semiconductor substrate from the back surface.

A semiconductor package may be provided. The semiconductor package may include a package substrate, a semiconductor chip on the package substrate, a solder resist pattern disposed between the package substrate and the semiconductor chip, the solder resist pattern having an opening region, an alignment mark disposed on the package substrate, the alignment mark in the opening region, and a solder paste pattern on a side surface of the alignment mark adjacent to the semiconductor chip, wherein the solder paste pattern is disposed between the semiconductor chip and the package substrate.