Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/15
Details of package parts other than the semiconductor or other solid state devices to be connected
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H01L2924/151
Die mounting substrate
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H01L2924/1532
the connection portion being formed on the die mounting surface of the substrate
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H01L2924/1533
the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
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H01L2924/15333
being a land array, e.g. LGA
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