The invention relates to a method for the surface modification of microstructured components having a polar surface, in particular for high-pressure applications. According to said method, a microstructured component is contacted, in particular treated, with a modification reagent, the surface properties of said component being modified by chemical and/or physical interaction of the component surface and of the modification reagent.

An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens. The apparatus further includes at least one stress compensation ring over a portion of the lens material and over at least a portion of the piezoelectric capacitor. The at least one stress compensation ring is configured to at least partially reduce bending of the lens material caused by stress on or in the lens material.

An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens. The apparatus further includes at least one stress compensation ring over a portion of the lens material and over at least a portion of the piezoelectric capacitor. The at least one stress compensation ring is configured to at least partially reduce bending of the lens material caused by stress on or in the lens material.

The disclosure relates to a process for producing a base of an analysis cell for analyzing a biochemical material. Here, carbon-rich precursor molecules and low-carbon precursor molecules are deposited on a substrate in a defined mixing ratio in order to form a precursor layer, wherein the low-carbon precursor molecules have a defined size and a hydrophobic end group. In a further step, the precursor layer is post-treated in a suitable manner in order to produce the base as a layer with at least one pore having a pore size dependent on the defined size and a pore count dependent on the defined mixing ratio.

Techniques described herein generally relate to generating fluid flow in a micro structure. In some examples, a micropump is described that includes at least two membranes and a spacer. The membranes can be configured to oscillate along a first and second directional path to generate fluid flow.

An optical device includes a support portion, a movable portion; and a pair of torsion bars. An optical function portion is provided on one surface of the movable portion and a rib portion is provided on the other surface of the movable portion. The rib portion includes eight extending portions of first to eighth extending portions. When setting directions in which the first to eighth extending portions extend as first to eighth extending directions respectively, and setting an angle between the first and second extending directions as a first angle, an angle between the third and fourth extending directions as a second angle, an angle between the fifth and sixth extending directions as a third angle, and an angle between the seventh and eighth extending directions as a fourth angle, each of the first and second angle is larger than each of the third and fourth angle.

A micro-electro-mechanical system (MEMS) package includes a wafer with an interconnect layer disposed thereon. A first device substrate including a first MEMS device and a second device substrate including a second MEMS device are laterally spaced apart from each other and disposed on the wafer. A first and a second bond seal rings are disposed below the first and the second device substrates, respectively, and both bonded to the interconnect layer. A first handle substrate includes a first cavity having a first pressure, and is bonded to the first device substrate. A second handle substrates includes a second cavity having a second pressure different from the first pressure, and is bonded to the second device substrate. A hole is disposed in the second bond seal ring for pressure adjustment in the second cavity.

A contact having a first contact member having an exposed surface, the exposed surface having irregularities, undulations, or asperities that form one or more high points and low points on the exposed surface, a second contact member having a contact base surface, a plurality of electrically conductive flexures extending from the contact base surface, and when the first contact member is positioned adjacent to the second contact member in a closed position in which the contact base surface of the second contact member is not in electrical contact with the one or more high points on the exposed surface of the first contact member, each flexure of the plurality of flexures is in electrical contact with the exposed surface of the first contact member.

A micro-electro-mechanical system (MEMS) optical sensor, method of detecting sound using the MEMS optical sensor and method of manufacturing. The MEMS optical sensor including a substrate having a base portion and a vertically extending support portion. The sensor further including a top plate having a compliant membrane configured to vibrate in response to acoustic waves, the top plate connected to the support portion and having a reflective surface. The sensor also includes a back plate connected to the support portion, the back plate having a grating portion positioned below the reflective surface portion and a base plate connected to the support portion at a position below the back plate. A light emitter, a light detector and circuitry operable to tilt the top plate and the back plate with respect to the base plate so as to direct the reflected laser light toward the light detector are further provided.

A device includes a cap wafer with a sealing region surrounding a gap-control region, and a structure wafer with a corresponding sealing region and gap-control region. The cap wafer has top and bottom surfaces, defining an xy-plane, and a vertical z-direction perpendicular to this plane. The structure wafer is similarly oriented, with its top surface parallel to the xy-plane. The cap wafer and structure wafer are bonded by a eutectic seal connecting their sealing regions, ensuring alignment of their gap-control regions along the z-axis. The device also includes a metal layer located on the bottom surface of the cap wafer in its gap-control region, and the structure wafer features a standoff protruding from its top surface within its gap-control region, extending along the z-direction to contact the metal layer.