A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.

A semiconductor structure includes a substrate, a MEMS substrate, a dielectric structure between the substrate and the MEMS substrate, a cavity in the dielectric structure, an electrode over the substrate, and a protrusion disposed in the cavity. The MEMS substrate includes a movable membrane, and the cavity is sealed by the movable membrane. A height of the protrusion is less than a depth of the cavity.

Microfluidic structures featuring substantially circular channels may be fabricated by embossing polymer sheets.

A method for providing a microstructured surface comprising selecting a material having a desired hardness; selecting a microstructure pattern having an arrangement of microfeatures providing a touch aesthetic to be applied to said material, wherein the width and aspect ratio of the microstructures are configured to provide said touch aesthetic for the hardness of the material selected; selecting said microstructure pattern to further include a physical property independent of said touch aesthetic to be applied to said material, wherein at least one of a pitch and spacing of said microfeatures is configures to provide said physical property; determining the dimensions of said microstructure pattern to be applied to the surface of said material to achieve the desired properties; and, applying the microstructure pattern to said material.

A method for forming a semiconductor structure includes following operations. An interconnect structure is formed over a substrate. The interconnect structure includes a top conductive layer. A dielectric structure is formed over the interconnect structure. The dielectric structure is patterned to simultaneously form a cavity and a protrusion in the cavity. A MEMS substrate is bonded to the dielectric structure to seal the cavity. The protrusion is separated from the MEMS substrate.

The application describes a MEMS transducer comprising a substrate having a cavity. The transducer exhibits a membrane layer supported relative to the substrate to define a flexible membrane. An upper surface of the substrate comprises an overlap region between the edge of the cavity and a perimeter of the flexible membrane where the membrane overlies the upper surface of the substrate. At least one portion of the overlap region of the upper surface of the substrate is provided with a plurality of recesses. The recesses are defined so as to extend from the edge of the cavity towards the perimeter of the flexible membrane.

A micromechanical component including a mounting support, a coil winding retained by a coil brace, and an adjustable part, the coil brace and the adjustable part being connected to each other and via at least one spring element with the mounting support in such a way that the adjustable part is adjustable relative to the mounting support about at least one axis of rotation, and a stop support being fixedly disposed or developed on the mounting support and being at least partially framed by the coil brace, which stop support has at least one first stop area protruding on a surface of the mounting support, which limits a relative movement at least of the coil brace in at least one direction relative to the mounting support by a contact of the at least one first stop area with the coil brace.

A micromechanical system includes a substrate; a functional element that is mounted to as to allow movement in relation to the substrate; and an elastic stop element. The stop element has a first end that is attached to the substrate, and a second end that is configured to engage with the functional element when the functional element is deflected by a predefined amount from a neutral position. The stop element has an elastic configure in a first direction that coincides with a preferred direction of the functional element, and in a second direction that extends at a right angle to the first direction.

Embodiments of the present invention relate to the technical field of semiconductor devices and disclose a MEMS microphone and a method for preparing the same. In the disclosure, the substrate is provided with at least one chamfer at an inner edge of a side of the substrate close to the diaphragm, so that when the diaphragm is bent towards the substrate due to vibration, providing the chamfer can prevent the diaphragm from hitting the substrate, or increase the contact area between the diaphragm and the substrate when the diaphragm hits the substrate, avoiding the concentration of stress and thus reducing the risk of the diaphragm breaking. In this way, the probability of failure of the MEMS microphone due to breakage of the diaphragm can be reduced, and the robustness of the MEMS microphone can be enhanced.

A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.