A substrate processing apparatus includes a substrate processing unit and a controller. The substrate processing unit is configured to perform an etching processing on one or more substrates each having a silicon nitride film and a silicon oxide film on a surface thereof with a processing liquid containing a phosphoric acid aqueous solution and a silicic acid compound. The controller is configured to control individual components of the substrate processing apparatus. The controller includes a concentration control unit configured to control a phosphoric acid concentration of the processing liquid such that etching selectivity of the silicon nitride film with respect to the silicon oxide film falls within a given range from a beginning of the etching processing to an end thereof.

The instant disclosure discloses a reticle retaining system comprising an inner pod and an outer pod. The inner pod is configured to receive a reticle that includes a first identification feature. The inner pod comprises an inner base having a reticle accommodating region generally at a geometric center thereof and surrounded by a periphery region, and an inner cover configured to establish sealing engagement with the inner base. The inner base has a first observable zone defined in the reticle accommodating region correspondingly arranged to allow observation of the first identification feature. The outer pod is configured to receive the inner base. The outer pod comprises an outer base having a second observable zone defined thereon observably aligned to the first observable zone of the inner pod upon receiving the inner pod, and an outer cover configured to engage the outer base and cover the inner pod.

Methods of transferring a substrate during a semiconductor device fabrication process include receiving the substrate at a mobile robot, moving the mobile robot with the substrate, and aligning the mobile robot with a mobile robot interface device, transferring the substrate from the mobile robot to the mobile robot interface device, and while transferring the substrate from the mobile robot to the mobile robot interface device, charging a battery of the mobile robot.

A front opening unified pod has a housing and a plurality of horizontal support members disposed within the housing and adapted to accommodate a plurality of semiconductor wafers or panels. The plurality of semiconductor wafers or panels have a different size or shape, such as circular and rectangular. A first one of the plurality of horizontal support members has a wing to support the plurality of different size or shape semiconductor wafers or panels. The plurality of horizontal support members has a first side horizontal support member, a second side horizontal support member, and a center horizontal support member disposed between the first side horizontal support member and the second side horizontal support member. The plurality of horizontal support members is insertable into the housing. One or more of the plurality of horizontal support members has an opening for laser identification.

Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.

A wafer aligner that includes a body, a stage, a stand, an optical module and a control module is provided. The stage is movably disposed on the body. The stand is vertically disposed on the body and partially suspended above the body to allow the stand and the body to form a detection space. A wafer is carried on the stage and driven by the stage to rotate relative to the body, and an edge of the wafer passes by the detection space. At least one surface of the detection space formed by the stand and the body is a light-absorbing surface. The optical module includes a light source and an image capture device. The light source is disposed in the body. The image capture device is disposed in the stand. The control module electrically connects the stage and the optical module.

The present disclosure relates to a scanning holography-based substrate alignment apparatus and method, wherein the apparatus includes: a sample fixing unit including a plurality of holders configured to support substrates at different positions by fixing each of the substrates at both ends thereof, each of the substrates including a substrate and a chip; a sample transfer unit configured to move the substrates at the different positions supported by the plurality of holders to a specific position; a holographic information receiving unit configured to receive holographic information about the substrates at the different positions from a holographic optical apparatus; a substrate position determination unit configured to analyze the holographic information through a holographic signal processing apparatus to determine position information for the substrates at the different positions; and a substrate position re-aligning unit configured to re-align the substrates at the different positions using the position information.

Provided is a semiconductor chip management apparatus including an acquiring unit which acquires an image of a metal portion of a semiconductor chip, an image processing unit which extracts an appearance feature of the metal portion from the image, and a recording unit which records the appearance feature as identification information on the semiconductor chip. The recording unit may record the appearance feature and a fabrication history of the semiconductor chip in association with each other. The semiconductor chip may have a semiconductor substrate, and a protective film provided above an upper surface of the semiconductor substrate and covering at least part of the metal portion, and the acquiring unit may acquire the image of the metal portion covered with the protective film.

The present invention relates to a method of pre-adjusting a glass substrate for a glass substrate semiconductor package to significantly shorten manufacturing time and improve manufacturing efficiency includes selecting one material group from among a plurality of material groups, each of which has a plurality of glass substrates, collecting processing process information by a processing equipment for performing a processing process on the plurality of glass substrates belonging to the one material group according to identification codes, checking according to the processing process information, whether a transfer equipment associated with the processing equipment for performing a current processing process and a transfer equipment associated with the processing equipment for performing a next processing process are each provided with a flipper, and pre-adjusting each of the plurality of glass substrates by rotating the each of the plurality of plurality of glass substrates using the processing equipment for the current processing process.

The tracing method according to the present disclosure includes: coding solar cells disposed in a loading frame according to a frame code of a loading frame, such that each respective solar cell has a respective cell code; obtaining respective process information of the respective solar cell according to a loading order, where the process information includes a code of a process carrier, a code of a workbench and a position code of a solar cell in the process carrier; uploading cell codes and process information of the solar cells to a computer system; and recording and associating, by the computer system, the respective cell code and the respective process information.