A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

A cassette handle includes a body, a first foot, and a second foot. When in a position following the application of a force to the body, the first foot and the second foot can engage a cassette for semiconductor wafers or samples. When in another position following the removal of the applied force, or absent an application of a force to the body, the first foot and the second foot are disengaged from the cassette. Recesses and/or markers on the first foot and the second foot indicate when the first foot and the second foot are correctly engaged with the cassette. Where the cassette handle includes both recesses and markers, the markers may be inset within the recesses.