A chip transferring method includes steps of: providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion of the plurality of chips and a second portion of the plurality of chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion of the plurality of chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion of the plurality of chips from the first load-bearing structure; dividing the first portion of the plurality of chips into a plurality of blocks, wherein each of the plurality of blocks comprising multiple chips of the first portion of the plurality of chips; and transferring the first portion of the plurality of chips in one of the plurality of blocks to a second load-bearing structure in single-batch.

A manufacturing method of a chip-attached substrate includes preparing a stacked substrate including multiple chips, a first substrate to which the multiple chips are temporarily bonded, and a second substrate bonded to the first substrate with the multiple chips therebetween; and separating the multiple chips bonded to the first substrate and the second substrate from the first substrate to bond the multiple chips to one surface of a third substrate including a device layer.

The present invention relates to a method of pre-adjusting a glass substrate for a glass substrate semiconductor package to significantly shorten manufacturing time and improve manufacturing efficiency includes selecting one material group from among a plurality of material groups, each of which has a plurality of glass substrates, collecting processing process information by a processing equipment for performing a processing process on the plurality of glass substrates belonging to the one material group according to identification codes, checking according to the processing process information, whether a transfer equipment associated with the processing equipment for performing a current processing process and a transfer equipment associated with the processing equipment for performing a next processing process are each provided with a flipper, and pre-adjusting each of the plurality of glass substrates by rotating the each of the plurality of plurality of glass substrates using the processing equipment for the current processing process.