A semiconductor device includes: a first semiconductor chip and a second semiconductor chip each including a first main electrode on a bottom surface side and a second main electrode on a top surface side; a conductive member provided to electrically connect the first main electrode of the first semiconductor chip to the second main electrode of the second semiconductor chip; a first external terminal electrically connected to the second main electrode of the first semiconductor chip and partly opposed to the conductive member, and a resin member provided to be at least partly arranged between the conductive member and the first external terminal.

An electronic device includes a lead with a first portion that extends outward from a package structure and is coated with a dielectric film that extends to the side of the package structure, and an uncoated second portion that extends from the first portion to an end of the lead. A method includes forming a package structure to enclose an interior portion of a lead structure and coating an exterior first portion of the lead structure with a dielectric film that extends to a side of the package structure and leaving an exterior second portion of the lead structure uncoated.

A terminal structure of an interconnect substrate is configured with a depression region and includes an electrically conductive element, a crack-inhibiting dielectric wall and an interfacial dielectric layer. The crack-inhibiting dielectric wall, superimposed over the depression region, is a part of a crack-inhibiting dielectric frame which can reduce warpage caused by the application of the interfacial dielectric layer. The depression region has an open lateral end at a periphery of the terminal structure, a closed lateral end opposite to the open lateral end and formed by an outward lateral surface of the electrically conductive element, and a depression surface at a level between top and bottom surfaces of the electrically conductive element. Accordingly, the depression region of the terminal structure can enhance the inspectability of solder joints by promoting the formation of solder fillets.