A display device according to an embodiment includes: a display panel; a first pad portion disposed on a lateral side of the display panel; and an information code disposed on the lateral side of the display panel.

Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.

A semiconductor package may include a package substrate including a chip mounting region; a semiconductor chip on the chip mounting region of the package substrate; a molding member on the semiconductor chip and the package substrate, the molding member including at least one marking groove in an upper surface of the molding member; and at least one marking pattern in the at least one marking groove.