H10W20/068

Method and device for repairing circuit on array substrate, and array substrate

Disclosed are a method and a device for repairing a circuit on an array substrate, and an array substrate. The method includes: determining a section to be repaired on each signal line; applying a conductive material to form a repair line between two ends of the section to be repaired, the repair line being connected with two ends of the section to be repaired; and applying an insulating material to form a cover layer above the repair line, the cover layer completely covers the surface of the repair line.

METHOD OF FABRICATING PACKAGE STRUCTURE

Provided is a method of fabricating a package structure including: forming a first bonding layer over a first surface of a first die; forming a release structure over a first carrier; bonding the first die to the first carrier by contacting the first bonding layer with the release structure; performing a laser process to divide the release structure into a first portion and a second portion, thereby debonding the first carrier from the first die; and performing a first removal process on the first portion of the release structure over the first carrier to expose a surface of the first carrier. The cleaned first carrier can be reused to fabricate another package structure, thereby reducing manufacturing costs and be greener or more environmentally friendly.

Trim cut with Qrate adjustment

A method of fabricating an electronic component includes: controlling a laser cutting tool at a first pulse rate to form a first cut portion in a feature of the electronic component, the feature having opposite first and second sides spaced apart from one another along a first direction, and third and fourth sides spaced apart from one another along a second direction, the first cut portion extending from the third side toward the fourth side; controlling the laser cutting tool at a higher second pulse rate and to form a second cut portion extending from the first cut portion toward the fourth side; and controlling the laser cutting tool at a third pulse rate to form a final cut portion extending from the second cut portion toward the fourth side, the third pulse rate less than the second pulse rate.