High efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.

Techniques for cooling are disclosed. A wafer-scale silicon interposer (WSSI) is accessed. A front side of the WSSI is bonded to a plurality of functional chips. The chips create heat during operation. The WSSI includes a plurality of through-silicon vias (TSVs). A back side of the WSSI is coupled to a plurality of DC-to-DC power converters. A cold plate is attached to the chips. The cold plate comprises an inlet plate, a jet-plate, and a fin-plate. A coolant at a first temperature is sent into at least one inlet plate inlet nozzle. The sending includes spraying the coolant on the fin-plate. At least a portion of the heat that was created, by the cold plate, is transferred to the coolant. The coolant is captured, at a second temperature, from one or more outlet chambers within the jet-plate.