A semiconductor device includes: a first semiconductor chip and a second semiconductor chip each including a first main electrode on a bottom surface side and a second main electrode on a top surface side; a conductive member provided to electrically connect the first main electrode of the first semiconductor chip to the second main electrode of the second semiconductor chip; a first external terminal electrically connected to the second main electrode of the first semiconductor chip and partly opposed to the conductive member, and a resin member provided to be at least partly arranged between the conductive member and the first external terminal.

A semiconductor device includes an insulating substrate, a plurality of semiconductor elements, a gate terminal, a printed circuit board and a passive component. The insulating substrate has a wiring. Each of the plurality of semiconductor elements has a first main electrode disposed on a first surface, a second main electrode disposed on a second surface opposite to the first surface, and a gate pad disposed on the second surface. The first main electrodes of the plurality of semiconductor elements are commonly connected to the wiring. The printed circuit board provides a gate wiring that electrically relays the gate pad and the gate terminal. The passive component includes a ferrite bead or a balance resistor. The passive component is mounted on the printed circuit board to adjust an impedance of the gate wiring.

A semiconductor device includes two first switching elements mounted on a first die pad. Each of the two first switching elements includes a first control electrode connected to a first control lead by a first control connection member. The first control connection member includes a lead connector connected to the first control lead and electrode connectors connected between the lead connector and the first control electrodes of the first switching elements. The electrode connectors are equal in length. Thus, the connection members between the first control lead and the first control electrodes of the first switching elements are equal in length.

An interconnection clip for a semiconductor package and semiconductor device or package comprising the same. The clip comprises a first metal and a second metal, wherein the first metal is copper and the second metal is tungsten or molybdenum; and one or more cavities provided on a first side of the clip, wherein the first side of the clip is configured for attachment to a die top of the semiconductor package.