Methods, systems, and devices for manufacturing technique for mechanical debonding of a carrier wafer from other structures in a stacked semiconductor system are described. The carrier wafer may include a first bonding layer that includes a first plurality of cavities. The stacked semiconductor system may also include a device wafer with a second bonding layer that is fusion bonded with the first bonding layer of the carrier wafer. The second bonding layer of the device wafer may include a second plurality of cavities.

A protective tape peeling apparatus may include a support table to support wafers having respective protective tapes attached thereto; a roller holder having an upper pinch roller and a lower pinch roller to move the protective tape peeled off from a wafer therebetween; an attachment portion to attach one end of the protective tape between the upper and lower pinch rollers to a first protective tape attached to a first wafer on the support table, and attach one end of the first protective tape between the upper pinch roller and the lower pinch roller to a second protective tape attached to a second wafer on the support table; and a reversing guide to reverse a non-adhesive surface of one end of the first protective tape between the upper and lower pinch rollers to face the support table when the roller holder moves from a first position to a second position.